Passive thermal solution for hand-held devices

Abstract

The present invention relates to a thermal solution for hand-held devices. In an embodiment, the present invention implements a thermal gap filler and a system enclosure for effective thermal management of high performance hand-held devices. In an embodiment, a hand-held device of the present invention increases the thermal power dissipation capability by reducing its system thermal resistance.

1 . A device comprising:
 a casing;   an electronic package at least partially enclosed in the casing; and   a gap filler adjacent to the electronic package,   wherein:
 the device has EMI shielding properties. 
   
   
   
       2 . The device of  claim 1  further comprising:
 a heat spreader adjacent to the gap filler.   
   
   
       3 . The device of  claim 1  wherein:
 the casing is a thermally conductive casing.   
   
   
       4 . The device of  claim 3  wherein:
 the thermally conductive casing comprises a material selected from the group consisting of polyphenylene sulfide, liquid crystalline polymer, magnesium, polyphenylene sulfide, polypropylene, thermoplastic elastomer, polyamide, and polybutene terephthalate.   
   
   
       5 . The device of  claim 3  wherein:
 a thermal conductivity of the thermally conductive casing is greater than approximately 2 W/m-K.   
   
   
       6 . The device of  claim 5  wherein:
 the thermal conductivity of the thermally conductive casing is in a range from 2 W/m-K to 20 W/m-K.   
   
   
       7 . The device of  claim 5  wherein:
 the gap filler provides a heat path from the electronic package to the thermally conductive casing, wherein the heat path is substantially free of air gaps.   
   
   
       8 . The device of  claim 1  wherein:
 the gap filler comprises a material selected from the group consisting of acrylate resin and silicone.   
   
   
       9 . The device of  claim 1  wherein:
 a thermal conductivity of the gap filler is greater than about 1 W/m-K.   
   
   
       10 . The device of  claim 1  wherein:
 the gap filler substantially fills a volume enclosed by the casing not filled by other components within the casing.   
   
   
       11 . The device of  claim 1  wherein:
 the device is a hand-held, portable device.   
   
   
       12 . The device of  claim 1  further comprising:
 an EMI shield within the casing,   wherein:
 the EMI shielding properties are provided by the EMI shield; and 
 a thermal conductivity of the EMI shield is greater than 150 W/m-K. 
   
   
   
       13 . A thermally-enhanced shielding solution comprising:
 a casing;   an electronic package at least partially enclosed in the casing;   an EMI shield adjacent to the electronic package; and   a thermal gap filler between the EMI shield and the electronic package,   wherein:
 a thermal conductivity of the thermal gap filler is greater than about 1 W/m-K; 
 the thermal gap filler provides a heat path from the electronic package to the casing; and 
   the heat path is substantially free of air gaps such that the thermal gap filler substantially fills a volume enclosed by the casing not filled by other components within the casing.   
   
   
       14 . The thermally-enhanced shielding solution of  claim 13  further comprising:
 a heat spreader adjacent to the thermal gap filler.   
   
   
       15 . The thermally-enhanced shielding solution of  claim 13  wherein:
 the casing comprises a material selected from the group consisting of polyphenylene sulfide, liquid crystalline polymer, magnesium, polyphenylene sulfide, polypropylene, thermoplastic elastomer, polyamide, and polybutene terephthalate; and   the gap filler comprises a material selected from the group consisting of acrylate resin and silicone.   
   
   
       16 . A device comprising:
 a casing;   an electronic package at least partially enclosed in the casing;   a gap filler adjacent to the casing; and   a heat spreader adjacent to the gap filler,   wherein:
 a space between the electronic package and the casing has EMI shielding properties. 
   
   
   
       17 . The device of  claim 16  further comprising:
 an EMI shield in the space between the electronic package and the casing.   
   
   
       18 . The device of  claim 17  wherein:
 the EMI shield has a thermal conductivity greater than 150 W/m-K.   
   
   
       19 . The device of  claim 18  wherein:
 the EMI shield has a thermal conductivity in a range between 150 W/m-K and 400 W/m-K.   
   
   
       20 . The device of  claim 17  wherein:
 the EMI shield is disposed between a first portion and a second portion of the gap filler.