US2010015763A1PendingUtilityA1

Rescue structure and method for laser welding

Assignee: LIU CHU-YUPriority: May 9, 2006Filed: Sep 29, 2009Published: Jan 21, 2010
Est. expiryMay 9, 2026(expired)· nominal 20-yr term from priority
H10W 20/49H10D 86/441H10D 86/60G02F 1/136259G02F 1/136263
49
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A rescue structure to repair an open wire includes a first metal layer having at least a rescue line, an isolation layer formed on the first metal layer, and a second metal layer formed on the isolation layer. The second metal layer has at least a signal line crossing the rescue line to form an enlarged intersection node. The intersection node is particularly arranged far from the side where the rescue line is used for signal transmission.

Claims

exact text as granted — not AI-modified
1 . A laser rescue method, comprising steps of:
 forming a first metal layer on a substrate;   laminating an isolation layer on said first metal layer;   laminating a second metal layer on said isolation layer;   laser welding to form a through slit in said second metal layer, said isolation layer and said first metal layer to expose a part of upper surface of said substrate, wherein said second metal layer, said isolation layer and said first metal layer all be divided into only two separated parts respectively; and   laser welding a portion of said second metal layer to let the melting portion of said second metal layer flow along a sidewall of the through slit to contact with said first metal layer.   
   
   
       2 . The laser rescue method according to  claim 1 , wherein the step of forming said first metal layer on said substrate is forming said first metal layer on a glass substrate. 
   
   
       3 . The laser rescue method according to  claim 1 , wherein the step of laser welding to form said through slit in said second metal layer, said isolation layer and said first metal layer is performed with a low-power laser. 
   
   
       4 . The laser rescue method according to  claim 1 , wherein after the step of forming said through slit in said second metal layer, said isolation layer and said first metal layer, there is no signal transmission between said two separated parts of said second metal layer and said first metal layer respectively.

Join the waitlist — get patent alerts

Track US2010015763A1 — get alerts on status changes and closely related new filings.

We store only your email — no account needed. See our privacy policy.