Conductive elastomeric and mechanical pin and contact system

Abstract

A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector ( 1 ) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins ( 2 ), installed in an insulator ( 3 ), each mechanical pin is topped with conductive elastromeric compound ( 4 ). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. This connector will mate between printed circuit boards, packaged electronic assembles, BGAs or LGA type products, harnesses or cables without the need of solder or pins and sockets. Eliminating solder or pins and sockets reduces the pitch between connections. Mechanical pins are plated drawn, formed or machined conductive metal alloys. Insulator is molded or machined out of engineered plastic examples being, but not limited to, FR-4, Ultem®, Polyimide, Torlon®. Electrically conductive elastromeric compounds made up of flexible silicone and rubbers with conductive compounds added.

1 .- 14 . (canceled) 
   
   
       15 . A process for fabricating a connector comprising:
 forming holes in a polyimide film substrate;   placing a metal ball in each hole with the ball having a diameter which is smaller than said hole and using any temporary means on one surface of said substrate to prevent said balls from dropping out of said holes;   placing pressure on each ball so as to deform it such that its diameter increases sufficiently to form a press fit with the walls of said hole such that each said ball is retained in its hole when said temporary means is removed; and   placing a stencil over said film substrate with holes in said stencil co-located with holes in said substrate;   wiping a conductive, flexible polymer onto said stencil so as to fill said holes in said stencil and come into physical and electrical contact with the tops of said balls; and   removing said stencil and allowing said polymer to cure.   
   
   
       16 . (canceled)