Resin for Thermal Imprinting

Abstract

A cyclic-olefin-based thermoplastic resin for thermal imprint to be used in the production of a sheet or a film which contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]<30. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved. Tg (° C.)>219×log[ M ]−160   [Equation 1]

1 . A resin for thermal imprint and for producing a sheet or a film, the resin comprising a cyclic-olefin-based thermoplastic resin that contains at least one of skeletons represented by a following chemical equation 1 or a following chemical equation 2 in a main chain, and wherein:
 a glass transition temperature Tg (° C.) of the resin and a value ([M]) of MFR at 260° C. satisfy a following equation 1; and   [M] <30; wherein
                       Tg (° C.)>219×log[ M]− 160 and further, wherein   [Equation 1] 
   R 1  to R 29  in chemical equations 1, 2 may differ or may be same, each of which is a substituent containing a hydrogen atom, a deuterium atom, a hydrocarbon radical having a carbon number of 1 to 15, a halogen atom, and a hetero atom of oxygen, sulfur, or the like, and may form a monocyclic or polycyclic structure with one another; m and n are integers greater than or equal to 0; and, [M] in equation 1 represents a value of MFR at 260° C.   
   
   
       2 . A resin for thermal imprint and for producing a sheet or a film, the resin comprising a cyclic-olefin-based thermoplastic resin that contains at least one of skeletons represented by a following chemical equation 3 or a following chemical equation 4 in a main chain, and wherein:
 a glass transition temperature Tg (° C.) of the resin and a value ([M]) of MFR at 260° C. satisfy a following equation 1; and   [M]<20 and Tg>90° C.; wherein
                       Tg (° C.)>219×log[ M]− 160 and further, wherein   [Equation 1] 
   R 1  to R 29  in chemical equations 3, 4 may differ or may be same, each of which is a substituent containing a hydrogen atom, a deuterium atom, a hydrocarbon radical having a carbon number of 1 to 15, a halogen atom, and a hetero atom of oxygen, sulfur, or the like, and may form a monocyclic or polycyclic structure with one another; m and n are integers greater than or equal to 0; and [M] in equation 1 represents a value of MFR at 260° C.   
   
   
       3 . The resin for thermal imprinting of  claim 2 , wherein the cyclic-olefin-based thermoplastic resin comprises a copolymer of cyclic-olefin represented by a following chemical equation 5 and α-olefin, or a polymer produced by hydrogenation after ring-opening polymerization of the cyclic-olefin, wherein 
     
       
         
         
             
             
         
       
       and further wherein R 30  to R 48  in chemical equation 5 may differ or may be same, each of which is a substituent containing a hydrogen atom, a deuterium atom, a hydrocarbon radical having a carbon number of 1 to 15, a halogen atom, and a hetero atom of oxygen, sulfur, or the like, and may form a monocyclic or polycyclic structure with one another; and, m and n are integers greater than or equal to 0. 
     
   
   
       4 . The resin for thermal imprint of  claim 2 , containing greater than or equal to one additive. 
   
   
       5 . The resin for thermal imprint of  claim 4 , wherein the additive contains at least either one of an anti-oxidizing agent or a lubricant. 
   
   
       6 . The resin for thermal imprint of  claim 2 , wherein a resin containing a skeleton represented by chemical equation 3 is a copolymer of cyclic-olefin represented by a following chemical equation 6 and ethylene; and wherein 
     
       
         
         
             
             
         
       
     
     and further wherein R 30  to R 48  in chemical equation 6 may differ or may be same, each of which is a substituent containing a hydrogen atom, a deuterium atom, a hydrocarbon radical having a carbon number of 1 to 15, a halogen atom, and a hetero atom of oxygen, sulfur, or the like, and may form a monocyclic or polycyclic structure with one another; and, m and n are integers greater than or equal to 0. 
   
   
       7 . A thermal imprint method comprising:
 pressing a mold, which is heated to less than or equal to a glass transition temperature Tg (° C.) of a resin for thermal imprint+65° C., against a sheet or a film comprising the resin for thermal imprint of  claim 1 , thereby transferring a pattern of the mold.   
   
   
       8 . A thermal imprint method comprising steps of:
 pressing a mold against a sheet or a film comprising the resin for thermal imprint of  claim 1 ; and   releasing the mold from the resin for thermal imprint at a temperature greater than or equal to a glass transition temperature (Tg) of the resin for thermal imprint−25° C.   
   
   
       9 . A thermal imprint method comprising:
 pressing a mold against a sheet or a film comprising the resin for thermal imprint of  claim 1  at less than or equal to 2.5 MPa, thereby transferring a pattern of the mold.   
   
   
       10 . A method of using a cyclic-olefin-based thermoplastic resin for an imprint process, the resin being used for producing a sheet or a film, and containing at least one of skeletons represented by a following chemical equation 7 or a following chemical equation 8 in a main chain, and wherein:
 a glass transition temperature Tg (° C.) of the resin and a value ([M]) of MFR at 260° C. satisfy a following equation 1; and   [M]<30 wherein,
                       Tg (° C.)>219×log[ M]− 160   [Equation 1] 
   and further wherein R 1  to R 29  in chemical equations 7, 8 may differ or may be same, each of which is a substituent containing a hydrogen atom, a deuterium atom, a hydrocarbon radical having a carbon number of 1 to 15, a halogen atom, and a hetero atom of oxygen, sulfur, or the like, and may form a monocyclic or polycyclic structure with one another; m and n are integers greater than or equal to 0; and [M] in equation 1 represents a value of MFR at 260° C.   
   
   
       11 . A method of using a cyclic-olefin-based thermoplastic resin for an imprint process, the resin being used for producing a sheet or a film, and containing at least one of skeletons represented by a following chemical equation 9 or a following chemical equation 10 in a main chain, and wherein:
 a glass transition temperature Tg (° C.) of the resin and a value ([M]) of MFR at 260° C. satisfy a following equation 1; and   [M]<20 and Tg>90° C. wherein
                       Tg (° C.)>219×log[ M]− 160   [Equation 1] 
   and further wherein R 1  to R 29  in chemical equations 9, 10 may differ or may be same, each of which is a substituent containing a hydrogen atom, a deuterium atom, a hydrocarbon radical having a carbon number of 1 to 15, a halogen atom, and a hetero atom of oxygen, sulfur, or the like, and may form a monocyclic or polycyclic structure with one another; m and n are integers greater than or equal to 0; and, [M] in equation 1 represents a value of MFR at 260° C.   
   
   
       12 . A thermal imprint method comprising:
 pressing a mold, which is heated to,less than or equal to a glass transition temperature Tg (° C.) of a resin for thermal imprint+65° C., against a sheet or a film comprising the resin for thermal imprint of  claim 2  thereby transferring a pattern of the mold.   
   
   
       13 . A thermal imprint method comprising steps of:
 pressing a mold against a sheet or a film comprising the resin for thermal imprint of  claim 2 ; and   releasing the mold from the resin for thermal imprint at a temperature greater than or equal to a glass transition temperature (Tg) of the resin for thermal imprint−25° C.   
   
   
       14 . A thermal imprint method comprising:
 pressing a mold against a sheet or a film comprising the resin for thermal imprint of  claim 2  at less than or equal to 2.5 MPa, thereby transferring a pattern of the mold.   
   
   
       15 . A thermal imprint method comprising:
 pressing a mold, which is heated to less than or equal to a glass transition temperature Tg (° C.) of a resin for thermal imprint+65° C., against a sheet or a film comprising the resin for thermal imprint of  claim 3  thereby transferring a pattern of the mold.   
   
   
       16 . A thermal imprint method comprising steps of:
 pressing a mold against a sheet or a film comprising the resin for thermal imprint of  claim 3 ; and   releasing the mold from the resin for thermal imprint at a temperature greater than or equal to a glass transition temperature (Tg) of the resin for thermal imprint−25° C.   
   
   
       17 . A thermal imprint method comprising:
 pressing a mold against a sheet or a4 film comprising the resin for thermal imprint of  claim 3  at less than or equal to 2.5 MPa, thereby transferring a pattern of the mold.   
   
   
       18 . A thermal imprint method comprising:
 pressing a mold, which is heated to less than or equal to a glass transition temperature Tg (° C.) of a resin for thermal imprint+65° C., against a sheet or a film comprising the resin for thermal imprint of  claim 4  thereby transferring a pattern of the mold.   
   
   
       19 . A thermal imprint method comprising steps of:
 pressing a mold against a sheet or a film comprising the resin for thermal imprint of  claim 4 ; and   releasing the mold from the resin for thermal imprint at a temperature greater than or equal to a glass transition temperature (Tg) of the resin for thermal imprint−25° C.   
   
   
       20 . A thermal imprint method comprising:
 pressing a mold against a sheet or a film comprising the resin for thermal imprint of  claim 4  at less than or equal to 2.5 MPa, thereby transferring a pattern of the mold.