Solar cell panels and method of fabricating same

Abstract

A solar cell panel and method of forming a solar cell panel. The method includes a: forming an electrically conductive bus bar on a top surface of a bottom cover plate; forming an electrically conductive contact frame proximate to a bottom surface of a top cover plate, the top cover plate transparent to visible light; and placing an array of rows and columns of solar cell chips between the bottom cover plate and the top cover plate, each solar cell chip of the array of solar cell chips comprising an anode adjacent to a top surface and a cathode adjacent to a bottom surface of the solar cell chip, the bus bar electrically contacting each anode of each solar cell chip of the array of solar cell chips and the contact frame contacting each anode of each solar cell chip of the array of solar cell chips.

1 . A structure, comprising:
 a bottom cover plate having an electrically conductive bus bar on a top surface of said bottom cover plate;   a top cover plate having an electrically conductive contact frame proximate to a bottom surface of said top cover plate, said top cover plate transparent to visible light; and   an array of rows and columns of solar cell chips between said bottom cover plate and said top cover plate, each solar cell chip of said array of solar cell chips comprising an anode adjacent to a top surface and a cathode adjacent to a bottom surface of the solar cell chip, said bus bar electrically contacting each anode of each solar cell chip of said array of solar cell chips and said contact frame contacting each anode of each solar cell chip of said array of solar cell chips.   
     
     
         2 . The structure of  claim 1 , wherein said top surface of said bottom cover plate is facing said bottom surfaces of each solar cell chip of said array of solar cell chips and said bottom surface of said top cover plate is facing said top surfaces of each solar cell chip of said array of solar cell chips. 
     
     
         3 . The structure of  claim 1 , further including:
 an encapsulant formed along all edges of said top and bottom cover plates, said encapsulant hermetically sealing said array of solar cell chips between said top and bottom cover plates.   
     
     
         4 . The structure of  claim 1 :
 wherein said bus bur comprises a single plate contacting all cathodes of all solar cell chips of said array of solar cell chips and said contact frame comprises a set of parallel lands, anodes of all solar cell chips of a row of solar cell chips interconnected by a respective land of said set of lands.   
     
     
         5 . The structure of  claim 1 :
 wherein said bus bur comprises a first set of parallel lands, cathodes of all solar cell chips of a row of solar cell chips interconnected by a respective land of said first set of lands;   wherein said contact frame comprises a second set of parallel lands, anodes all solar cell chips of a same row of solar cell chips interconnected by a respective land of said set of second lands, said first set of parallel lands and said second set of parallel lands mutually parallel; and   further including electrically conductive clips electrically connecting lands of said first set of lands to lands of said second set of lands between adjacent rows of solar cell chips.   
     
     
         6 . The structure of  claim 1 , further including (i) an antireflective coating on said top surfaces of each solar cell chip of said array of solar cell chips, (ii) an antireflective coating on a top surface of said top cover plate or (iii) an antireflective coating on said top surfaces of each solar cell chip of said array of solar cell chips and an antireflective coating on a top surface of said top cover plate. 
     
     
         7 . The structure of  claim 1 , wherein said contact frame is transparent to visible light. 
     
     
         8 . The structure of  claim 1 , wherein said contact frame extends into said top cover plate. 
     
     
         9 . The structure of  claim 8 , wherein said contact frame has a triangular cross-section having a base side and two adjacent sides, said base side of said contact frame exposed in said bottom surface of said top cover plate, an apex of said contact frame formed by the intersection of said adjacent sides embedded in said top cover plate. 
     
     
         10 . The structure of  claim 1 , wherein said contact frame is formed on said bottom surface of said top cover plate. 
     
     
         11 . A method, comprising:
 forming an electrically conductive bus bar on a top surface of a bottom cover plate;   forming an electrically conductive contact frame proximate to a bottom surface of a top cover plate, said top cover plate transparent to visible light; and   placing an array of rows and columns of solar cell chips between said bottom cover plate and said top cover plate, each solar cell chip of said array of solar cell chips comprising an anode adjacent to a top surface and a cathode adjacent to a bottom surface of the solar cell chip, said bus bar electrically contacting each anode of each solar cell chip of said array of solar cell chips and said contact frame contacting each anode of each solar cell chip of said array of solar cell chips.   
     
     
         12 . The method of  claim 11 , wherein said top surface of said bottom cover plate is facing said bottom surfaces of each solar cell chip of said array of solar cell chips and said bottom surface of said top cover plate is facing said top surfaces of each solar cell chip of said array of solar cell chips. 
     
     
         13 . The method of  claim 11 , further including:
 encapsulating all edges of said top and bottom cover plates and hermetically sealing said array of solar cell chips between said top and bottom cover plates.   
     
     
         14 . The method of  claim 11 :
 wherein said bus bur comprises a single plate contacting all cathodes of all solar cell chips of said array of solar cell chips and said contact frame comprises a set of parallel lands, anodes of all solar cell chips of a row of solar cell chips interconnected by a respective land of said set of lands.   
     
     
         15 . The method of  claim 11 :
 wherein said bus bur comprises a first set of parallel lands, cathodes of all solar cell chips of a row of solar cell chips interconnected by a respective land of said first set of lands;   wherein said contact frame comprises a second set of parallel lands, anodes all solar cell chips of a same row of solar cell chips interconnected by a respective land of said set of second lands, said first set of parallel lands and said second set of parallel lands mutually parallel; and   further including placing electrically conductive clips to electrically connect lands of said first set of lands to lands of said second set of lands between adjacent rows of solar cell chips.   
     
     
         16 . The method of  claim 11 , further including (i) forming an antireflective coating on said top surfaces of each solar cell chip of said array of solar cell chips, (ii) forming an antireflective coating on a top surface of said top cover plate or (iii) forming an antireflective coating on said top surfaces of each solar cell chip of said array of solar cell chips and forming an antireflective coating on a top surface of said top cover plate. 
     
     
         17 . The method of  claim 11 , wherein said contact frame is transparent to visible light. 
     
     
         18 . The method of  claim 11 , wherein forming said contact frame comprises:
 forming trenches in said top cover plate, said grooves open to said bottom surface of said top cover plate;   forming a layer of electrically conductive material on said bottom surface of top cover plate; said electrically conductive material filling said trenches; and   removing said electrically conductive material from said bottom surface of said top cover plate, said electrically conductive material remaining in said trenches.   
     
     
         19 . The method of  claim 18 , wherein said trenches are triangular grooves and said contact frame has a triangular cross-section having a base side and two adjacent sides, said base side of said contact frame exposed in said bottom surface of said top cover plate, an apex of said contact frame formed by the intersection of said adjacent sides embedded in said top cover plate. 
     
     
         20 . The method of  claim 11 , wherein said contact frame is formed on said bottom surface of said top cover plate.