Heat dispensing unit for memory chip

Abstract

A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes multiple ridges extending from an outside thereof and two clamps clamp two ends of the two heat dispensing plates. Each clamp includes two side plates and a flexible plate which is connected between the two side plates, two protrusions extend from two respective insides of the two side plates so as to be engaged with two holes in the two heat dispensing plates to securely connect the two heat dispensing plates. The clamps each have two hooks to hook the notches in two ends of the chip.

1 . A heat dispensing unit comprising:
 two heat dispensing plates and a chip being clamped between the two heat dispensing plates, each heat dispensing plate having multiple ridges extending from an outside thereof and two holes defined through two ends thereof, and   Two clamps clamping the two ends of the two heat dispensing plates, each clamp having two side plates and a flexible plate connected between the two side plates, two protrusions extending from two respective insides of the two side plates, the two protrusions engaged with the holes of the two heat dispensing plates.   
   
   
       2 . The heat dispensing unit as claimed in  claim 1 , wherein two hooks extending from a lower edge of the flexible plate and hook two notches defined in two ends of the chip. 
   
   
       3 . The heat dispensing unit as claimed in  claim 1 , wherein a heat conductive pad is applied to an inside of each of the heat dispensing plates. 
   
   
       4 . The heat dispensing unit as claimed in  claim 1 , wherein two heat dispensing parts extend from a top of each of the heat dispensing plates and the heat dispensing parts extend inward from the top of each of the heat dispensing plates. 
   
   
       5 . The heat dispensing unit as claimed in  claim 1 , wherein each of the heat dispensing plates is an aluminum extruding plate.