US2010038055A1PendingUtilityA1
Heat dispensing unit for memory chip
Est. expiryAug 18, 2028(~2.1 yrs left)· nominal 20-yr term from priority
H10W 40/641
41
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes two connection plates bending from two ends thereof and the two connection plates have a connection piece or a connection port so that when the two heat dispensing plates are connected to each other, the connection pieces are connected to the connection ports.
Claims
exact text as granted — not AI-modified1 . A heat dispensing unit comprising:
two heat dispensing plates and a chip being clamped between the two heat dispensing plates, each heat dispensing plate having two connection plates bending from two ends thereof, the two connection plates of one of the two heat dispensing plates having a connection piece and the two connection plates of the other one of the two heat dispensing plates having a connection port defined therein, each of the connection pieces having a contacting portion which is engaged with an inside of the connection port corresponding thereto when the connection pieces are connected to the connection ports.
2 . The heat dispensing unit as claimed in claim 1 , wherein two guide units are connected to each of the two heat dispensing plates and each guide unit is composed of a first bending plate which is located beside the connection piece and a second bending plate which is located beside the connection port, the first and second bending plates are overlapped to each other when the two heat dispensing plates are connected to each other.
3 . The heat dispensing unit as claimed in claim 1 , wherein the connection piece is a plate split from the connection plate.
4 . The heat dispensing unit as claimed in claim 1 , wherein the connection port is a rectangular hole defined through the connection plate.
5 . The heat dispensing unit as claimed in claim 1 , wherein each of the heat dispensing plates includes a flange extending from a top thereof so as to cover a gap between the two heat dispensing plates.Cited by (0)
No later patents cite this yet.
References (0)
No backward citations on record.