Intermetallic bonded diamond (ibd) cutting elements

Abstract

A cutting element may include a substrate having a bonding interface region, and an intermetallic bonded diamond (IBD) element bonded to the bonding interface region of the substrate. In some embodiments, the bonding interface region of the substrate may have a non-axi-symmetrical shape and/or may be symmetrical about only one plane or about zero planes. In some embodiments, the bonding interface region of the substrate may have a shape of a tube, a beveled tube, a tube with one or more internal support structures, a scoop, a plow, a concave shape, a honeycombed shape, or other irregular or complex shape.

1 . A cutting element, comprising:
 a substrate having a bonding interface region; and   an intermetallic bonded diamond (IBD) element bonded to the bonding interface region of the substrate.   
     
     
         2 . A cutting element according to  claim 1 , wherein the substrate is formed from tungsten carbide. 
     
     
         3 . A cutting element according to  claim 1 , wherein the substrate is formed from steel. 
     
     
         4 . A cutting element according to  claim 1 , wherein the IBD element is bonded to the bonding interface region of the substrate by hot isostatic pressing (HIP). 
     
     
         5 . A cutting element according to  claim 1 , wherein the bonding interface region of the substrate has a non-axi-symmetrical shape. 
     
     
         6 . A cutting element according to  claim 1 , wherein the bonding interface region of the substrate has a shape that is symmetrical about only one plane. 
     
     
         7 . A cutting element according to  claim 1 , wherein the bonding interface region of the substrate has a shape that is not symmetrical about any plane. 
     
     
         8 . A cutting element according to  claim 1 , wherein the bonding interface region of the substrate includes a hole extending at least partially through the substrate. 
     
     
         9 . A cutting element according to  claim 1 , wherein the bonding interface region of the substrate includes a hole extending completely through the substrate. 
     
     
         10 . A cutting element according to  claim 1 , wherein the bonding interface region of the substrate has a shape of a tube, a beveled tube, a tube with one or more internal support structures, a scoop, a plow, a concave shape, or a honeycombed shape. 
     
     
         11 . A cutting element according to  claim 1 , wherein the bonding interface region of the substrate has a plow shape with an included angle of less than or equal to about 100 degrees. 
     
     
         12 . A cutting element according to  claim 1 , wherein the cutting element is configured for use in cutting ferrous materials. 
     
     
         13 . A fixed cutter drill bit, comprising:
 a bit body including one or more bit blades; and   one or more cutting elements bonded to at least one of the bit blades, at least one of the cutting elements including:
 a substrate having a bonding interface region; and 
 an intermetallic bonded diamond (IBD) element bonded to the bonding interface region of the substrate. 
   
     
     
         14 . A cutting element according to  claim 13 , wherein the bonding interface region of the substrate has a non-axi-symmetrical shape. 
     
     
         15 . A fixed cutter drill bit according to  claim 13 , wherein the bonding interface region of the substrate includes a hole extending at least partially through the substrate. 
     
     
         16 . A fixed cutter drill bit according to  claim 13 , wherein the bonding interface region of the substrate has a shape of a tube, a beveled tube, a tube with one or more internal support structures, a scoop, a plow, a concave shape, or a honeycombed shape. 
     
     
         17 . An apparatus for drilling an earthen formation, the apparatus comprising:
 a support structure; and   one or more cutting elements coupled to the support structure, each cutting element including:
 a substrate having a bonding interface region; and 
 an intermetallic bonded diamond (IBD) element bonded to the bonding interface region of the substrate. 
   
     
     
         18 . An apparatus according to  claim 17 , wherein the cutting elements are brazed into the support structure. 
     
     
         19 . An apparatus according to  claim 17 , wherein the bonding interface region of the substrate has a non-axi-symmetrical shape. 
     
     
         20 . An apparatus according to  claim 17 , wherein the bonding interface region of the substrate includes a hole extending at least partially through the substrate. 
     
     
         21 . An apparatus according to  claim 17 , wherein the bonding interface region of the substrate has a shape of a tube, a beveled tube, a tube with one or more internal support structures, a scoop, a plow, a concave shape, or a honeycombed shape.