Anodes with corner and edge modified designs

Abstract

Porous sintered anode bodies for capacitors formed from valve metals are treated by electrolysis to form a dielectric layer and coated with cathode layers. When standard parallelepiped shapes are used, cathode coverage at the edges and corners is non-uniform and failures occur at those locations. Rectangular prisms, obround prisms and cylindrical prisms are formed with transition surfaces at edges and corners, such as chamfers and curves, to enhance cathode layer uniformity. The transition surface greatly enhances the application of polymer slurries.

1 - 40 . (canceled) 
     
     
         41 . Capacitor precursor bodies prepared by the process of pressing a pellet of an anode in the shape of a regular prism, forming transition surfaces at edges of multiple surfaces, sintering the pellet, electrolyzing to form a dielectric oxide on the surface of the pellet and applying a slurry of a prepolymerized intrinsically conductive polymer to said oxidized pellet. 
     
     
         42 . Capacitor precursor bodies according to  claim 44  wherein said forming transition surfaces at edges of multiple surfaces occurs during pressing. 
     
     
         43 . Capacitor precursor bodies according to  claim 44  wherein said forming transition surfaces at edges of multiple surfaces occurs after pressing. 
     
     
         44 . Capacitor precursor bodies according to  claim 44  wherein said sintering is done prior to forming transition surfaces at edges of multiple surfaces or after forming transition surfaces at edges of multiple surfaces. 
     
     
         45 . Capacitor precursor bodies according to  claim 44  wherein said transition surfaces are substantially chamfers. 
     
     
         46 . Capacitor precursor bodies according to  claim 44  wherein said transition surfaces are substantially curves. 
     
     
         47 . Capacitor precursor bodies according to  claim 44  having an anode lead inserted into said pellet before pressing. 
     
     
         48 . Capacitor precursor bodies according to  claim 44  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 0.25 micrometers. 
     
     
         49 . Capacitor precursor bodies according to  claim 48  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 1.0 micrometers. 
     
     
         50 . Capacitor precursor bodies according to  claim 48  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 3 micrometers. 
     
     
         51 . Capacitor precursor bodies prepared by the process of pressing a pellet of a anode in the shape of a rectangular prism having transition surfaces at more than 5 intersections of at least two surfaces, sintering the pellet, electrolyzing to form a dielectric oxide on the surface of the pellet and applying a slurry of a prepolymerized intrinsically conductive polymer to said oxidized pellet. 
     
     
         52 . Capacitor precursor bodies according to  claim 51  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 0.25 micrometers. 
     
     
         53 . Capacitor precursor bodies according to  claim 52  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 1.0 micrometers. 
     
     
         54 . Capacitor precursor bodies according to  claim 52  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 3 micrometers. 
     
     
         55 . Capacitor precursor bodies prepared by the process of pressing a pellet of an anode in the shape of a rectangular prism, forming transition surfaces at all intersections of at least two surfaces, sintering the pellet, electrolyzing to form a dielectric oxide on the surface of the pellet and applying a slurry of a prepolymerized intrinsically conductive polymer to said oxidized pellet. 
     
     
         56 . Capacitor precursor bodies according to  claim 55  wherein said forming transition surfaces at all intersections of at least two surfaces occurs during pressing. 
     
     
         57 . Capacitor precursor bodies according to  claim 55  wherein said forming transition surfaces at all intersections of at least two surfaces occurs after pressing. 
     
     
         58 . Capacitor precursor bodies according to  claim 55  wherein said sintering is done prior to forming transition surfaces or after forming transition surfaces. 
     
     
         59 . Capacitor precursor bodies according to  claim 55  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 0.25 micrometers. 
     
     
         60 . Capacitor precursor bodies according to  claim 59  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 1.0 micrometers. 
     
     
         61 . Capacitor precursor bodies according to  claim 59  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 3 micrometers. 
     
     
         62 . Capacitor precursor bodies prepared by the process of oxidizing a pellet of a valve in the shape of a rectangular prism having transition surfaces at more than three intersections of three surfaces. 
     
     
         63 . Capacitor precursor bodies according to  claim 62  further comprising an intrinsically conductive polymer wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 0.25 micrometers. 
     
     
         64 . Capacitor precursor bodies according to  claim 63  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 1.0 micrometers. 
     
     
         65 . Capacitor precursor bodies according to  claim 63  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 3 micrometers. 
     
     
         66 . Capacitor precursor bodies prepared by the process of pressing a pellet of an anode in the shape of an obround prism wherein a prism shape is changed at least one intersection of two surfaces to create transition surfaces, sintering the pellet, electrolyzing to form a dielectric oxide on the surface of the pellet and applying a slurry of a prepolymerized intrinsically conductive polymer to said oxidized pellet. 
     
     
         67 . Capacitor precursor bodies according to  claim 66  wherein said prism shape is changed at least one intersection of two surfaces to create transition surfaces during pressing. 
     
     
         68 . Capacitor precursor bodies according to  claim 66  wherein said prism shape is changed at least one intersection of two surfaces to create transition surfaces after pressing. 
     
     
         69 . Capacitor precursor bodies according to  claim 66  wherein said sintering is done prior to said prism shape being changed at least one intersection of two surfaces to create transition surfaces or after said prism shape being changed at least one intersection of two surfaces to create transition surfaces. 
     
     
         70 . Capacitor precursor bodies according to  claim 66  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 0.25 micrometers. 
     
     
         71 . Capacitor precursor bodies according to  claim 70  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 1.0 micrometers. 
     
     
         72 . Capacitor precursor bodies according to  claim 70  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 3 micrometers. 
     
     
         73 . Capacitor precursor bodies prepared by the process of pressing a pellet of an anode in the shape of a cylindrical prism wherein the edge of at least one flat surface has been changed to create a transition surface, sintering the pellet, electrolyzing to form a dielectric oxide on the surface of the pellet and applying a slurry of a prepolymerized intrinsically conductive polymer to said oxidized pellet. 
     
     
         74 . Capacitor precursor bodies according to  claim 73  wherein said edge of at least one flat surface has been changed to create a transition surface during pressing. 
     
     
         75 . Capacitor precursor bodies according to  claim 73  wherein said edge of at least one flat surface has been changed to create a transition surface is after pressing. 
     
     
         76 . Capacitor precursor bodies according to  claim 73  wherein said sintering is done prior to edge of at least one flat surface has been changed to create a transition surface or after edge of at least one flat surface has been changed to create a transition surface. 
     
     
         77 . Capacitor precursor bodies according to  claim 73  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 0.25 micrometers. 
     
     
         78 . Capacitor precursor bodies according to  claim 77  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 1.0 micrometers. 
     
     
         79 . Capacitor precursor bodies according to  claim 78  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 3 micrometers. 
     
     
         80 . Capacitor precursor bodies prepared by the process of pressing a pellet of an anode in the shape of a rectangular prism, forming transition surfaces at more than five intersections of two surfaces, sintering the pellet, electrolyzing to form a dielectric oxide on the surface of the pellet and applying a slurry of a prepolymerized intrinsically conductive polymer to said oxidized pellet. 
     
     
         81 . Capacitor precursor bodies according to  claim 80  wherein said forming transition surfaces at more than five intersections of two surfaces occurs during pressing. 
     
     
         82 . Capacitor precursor bodies according to  claim 80  wherein said forming transition surfaces at more than five intersections of two surfaces occurs after pressing. 
     
     
         83 . Capacitor precursor bodies according to  claim 80  wherein said sintering is done prior to forming transition surfaces at more than five intersections of two surfaces or after forming transition surfaces at more than five intersections of two surfaces. 
     
     
         84 . Capacitor precursor bodies according to  claim 80  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 0.25 micrometers. 
     
     
         85 . Capacitor precursor bodies according to  claim 84  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 1.0 micrometers. 
     
     
         86 . Capacitor precursor bodies according to  claim 85  wherein said intrinsically conductive polymer is built up on said pellet to a thickness of at least about 3 micrometers. 
     
     
         87 . Capacitor precursor bodies according to  claim 51  wherein said transition surfaces are formed during pressing. 
     
     
         88 . Capacitor precursor bodies according to  claim 51  wherein said transition surfaces are formed after pressing. 
     
     
         89 . Capacitor precursor bodies according to  claim 51  wherein said sintering is done prior to forming transition surfaces or after forming transition surfaces.