Polishing Pad

Abstract

The present invention provides a polishing pad, and is more particularly related to a polishing pad, the width of groove bottom of polishing surface of which is 0 mm. The polishing pad includes a polishing surface on which comprises a plurality of grooves, wherein each groove includes a groove opening and a groove bottom, the characteristic of which being that the width of groove bottom of polishing surface is 0 mm. Therefore, when the polishing step is performed, it is not easy for polishing particles suspended in the slurry to deposit on the groove bottom and the deposits can be prevented from scratching the concerned work piece to avoid damage of work piece.

1 . A polishing pad, said polishing pad including a polishing surface, said polishing surface comprising a plurality of grooves on it, wherein said each groove includes a groove opening and a groove bottom, the characteristic of said polishing pad being in that width of said groove bottom of said polishing surface is 0 mm. 
     
     
         2 . The polishing pad according to  claim 1 , wherein between said groove opening and said groove bottom of said polishing pad comprises at least one section. 
     
     
         3 . The polishing pad according to  claim 2 , wherein said section is V-shaped. 
     
     
         4 . The polishing pad according to  claim 2 , wherein said section is U-shaped. 
     
     
         5 . The polishing pad according to  claim 2 , wherein between each said section comprises a bend to form an included angle. 
     
     
         6 . The polishing pad according to  claim 2 , wherein between said polishing surface and said section comprises a bend to form an included angle. 
     
     
         7 . The polishing pad according to  claim 6 , wherein degree of said included angle is about 90˜120 degrees. 
     
     
         8 . The polishing pad according to  claim 2 , wherein said section is a plane surface perpendicular to said groove bottom. 
     
     
         9 . The polishing pad according to  claim 2 , wherein said section is an inclined plane not perpendicular to said groove bottom. 
     
     
         10 . The polishing pad according to  claim 2 , wherein said section is an irregular curved surface. 
     
     
         11 . The polishing pad according to  claim 1 , wherein width of said groove opening and width of said groove bottom of said polishing pad are different. 
     
     
         12 . The polishing pad according to  claim 1 , wherein said polishing pad further includes a connecting surface for being connected to polishing surface of another polishing pad.