Resin board to be subjected to ozone treatment, wiring board, and method of manufacturing the wiring board

Abstract

A resin board that consists of at least one of a mixture of a plurality of types of resins having different degrees of susceptibility to erosion by an ozone solution, and a resin having, in a molecule, a plurality of types of components having different degrees of susceptibility to erosion by the ozone solution is treated with ozone water to form a reformed layer, and a catalyst metal is adsorbed by the reformed layer so as to form a resin-metal composite layer, on which a plating process is performed. In the resin board, a component or components that is/are likely to be eroded on by the ozone solution dissolves into the ozone solution, and pores or clearances on the order of nanometers are formed between the component(s) and a component or components that is/are less likely to be eroded by the ozone solution. With the plating deposited in the pores or clearances, the adhesion strength is improved due to an anchoring effect. Thus, the adhesion strength of the plating film is improved even where the resin-metal composite layer has a thickness of 10 to 200 nm.

1 . A resin board to be subjected to ozone treatment, which is adapted to be treated with an ozone solution, comprising:
 at least one of a mixture of a plurality of types of resins that have different degrees of susceptibility to erosion by the ozone solution, and a resin that has, in a molecule, a plurality of types of components having different degrees of susceptibility to erosion by the ozone solution.   
   
   
       2 . The resin board to be subjected to ozone treatment according to  claim 1 , wherein the resin board contains an aromatic epoxy resin that has both an aromatic cyanate compound and an epoxy group. 
   
   
       3 . A wiring board, comprising:
 the resin board as defined in  claim 1 ;   a resin-metal composite layer which is formed integrally on a surface of the resin board and in which fine metal particles are uniformly dispersed in a resin matrix; and   a wiring portion that comprises a plating film formed in a predetermined pattern on the resin-metal composite layer, wherein   the resin-metal composite layer has a thickness of 10 to 200 nm.   
   
   
       4 . A method of manufacturing a wiring board, comprising:
 a preparing step of preparing the resin board as defined in  claim 1 ;   an ozone treatment step of treating the resin board with an ozone solution so as to form a reformed layer having polar groups on a surface thereof;   an adsorption step of bringing the reformed layer into contact with a metal compound solution so that at least one of colloidal particles and ions of a catalyst metal are attached to the polar groups and fine particles of the catalyst metal are dispersed in the reformed layer, thereby to form a resin-metal composite layer; and   a plating step of performing a plating process on the resin-metal composite layer in a predetermined pattern so as to form a wiring portion of the predetermined pattern, wherein   the preparing step, the ozone treatment step, the adsorption step and the plating step are carried out in the order of description.   
   
   
       5 . The method according to  claim 4 , further comprising an etching step of removing an unnecessary portion of the resin-metal composite layer. 
   
   
       6 . A wiring board, comprising:
 the resin board as defined in  claim 2 ;   a resin-metal composite layer which is formed integrally on a surface of the resin board and in which fine metal particles are uniformly dispersed in a resin matrix; and   a wiring portion comprising a plating film formed in a predetermined pattern on the resin-metal composite layer, wherein   the resin-metal composite layer has a thickness of 10 to 200 nm.   
   
   
       7 . A method of manufacturing a wiring board, comprising:
 a preparing step of preparing the resin board as defined in  claim 2 ;   an ozone treatment step of treating the resin board with an ozone solution so as to form a reformed layer having polar groups on a surface thereof;   an adsorption step of bringing the reformed layer into contact with a metal compound solution so that at least one of colloidal particles and ions of a catalyst metal are attached to the polar groups and fine particles of the catalyst metal are dispersed in the reformed layer, thereby to form a resin-metal composite layer; and   a plating step of performing a plating process on the resin-metal composite layer in a predetermined pattern so as to form a wiring portion of the predetermined pattern, wherein   the preparing step, the ozone treatment step, the adsorption step and the plating step are carried out in the order of description.   
   
   
       8 . The method according to  claim 7 , further comprising an etching step of removing an unnecessary portion of the resin-metal composite layer.