Ic card and manufacturing method thereof

Abstract

This IC card is provided with a module having an inlet, an adhesive layer covering the module, and a first base material and second base material sandwiching the module with interposition of the adhesive layer. The module is disposed on one face of the first base material with interposition of a viscous layer which has a thickness that varies according to the thickness at each area of the module, and its two ends are narrower than its other parts when viewed from the outer face side of the first base material or the outer face side of the second base material. According to this IC card, it is possible to offer the IC card with a flat surface, and without occurrence of strain in the embedded IC chip.

1 . An IC card comprising a module having an inlet, an adhesive layer covering the pertinent module, and a first base material and second base material sandwiching said module with interposition of the pertinent adhesive layer, wherein:
 said module is disposed at least on a face of said first base material that contacts said adhesive layer, with interposition of a viscous layer which has a thickness that varies according to the thickness at each area of said module; and said viscous layer has at least one end that is narrower than its other parts when viewed from the outer face side of said first base material or the outer face side of said second base material.   
   
   
       2 . A manufacturing method of IC card provided with a module having an inlet, an adhesive layer covering the pertinent module, and a first base material and second base material sandwiching said module with interposition of the pertinent adhesive layer, comprising: a step in which a viscosity agent is applied or pasted onto one face of said first base material; a step in which an adhesive agent constituting said adhesive layer is applied to one face of said first base material; a step in which said module is disposed on one face of said first base material with interposition of said viscosity agent; a step in which said second base material is disposed so that said first base material and said second base material sandwich said module, said viscosity agent, and said adhesive agent; and a step in which said first base material and said second base material are subjected to pressurizing treatment from their outer sides and from one of their ends in the flow direction of said adhesive agent, wherein:
 in the manufacturing step in which said viscosity agent is applied, said viscosity agent is applied so that the ends of said viscosity agent are oriented in the flow direction of said adhesive agent, and said viscosity agent is applied in a spaced side-by-side manner in a thickness that varies according to the thickness at each area of said module.   
   
   
       3 . The manufacturing method of IC card according to  claim 2 , wherein, in the manufacturing step in which the adhesive agent is applied to one face of said first base material, said adhesive agent is applied in multiple stripes.