Refrigerant cooling system for an electronic apparatus and the method thereof

Abstract

A refrigerant cooling system for an electronic apparatus and the method thereof are provided. An enclosure is set with a fan on one side thereof; the enclosure is set with an opening on one side thereof. The enclosure is set with an electronic substrate inside with other electronic devices. The electronic substrate is set with a middle-temperature evaporator with an input end and an output end, in which the refrigerant is filled into the input end. The input end is set with a throttling device. The output end is set with a throttling device connecting to a low-temperature evaporator. The low-temperature evaporator is set with a condensed water drain-pan at a bottom side thereof and the condensation water drain-pan is connected to a drain pipe. The pipe of the output end of low-temperature evaporator is connected to a receiver or a compressor of a refrigerating system for a compression cycle.

1 . A refrigerant cooling system for an electronic apparatus, comprising:
 an enclosure, in which the enclosure is set with at least one fan on one side thereof, the fan is configured to draw air into the enclosure, the enclosure is set with a low-temperature evaporator, the enclosure is set with at least one opening on one side thereof, and the opening is adapted to exhaust the airflow out of the enclosure;   an electronic substrate, being set with a middle-temperature evaporator;   an input end, in which the input end is connected to one side of the electronic substrate by a pipe, and the pipe is set with a throttling device;   an output end, in which the output end is connected to another side of the electronic substrate by a pipe, a throttling device is connected to the pipe, the output end is then connected to an output end of the low-temperature evaporator via the pipe, a liquid-gaseous mixture state refrigerant flowing through the low-temperature evaporator is redirected to a receiver or a compressor of a refrigerating system to form a recycling cooling system; thereby the refrigerant cooling system for an electronic apparatus is formed by the aforementioned configuration.   
   
   
       2 . The refrigerant cooling system for an electronic apparatus as claimed in  claim 1 , wherein the low-temperature evaporator is set with a condensation water drain-pan at a bottom side thereof for collecting condensed water from airflow cooled by the low-temperature evaporator, and the condensed water is drained out of the enclosure via a drain pipe. 
   
   
       3 . The refrigerant cooling system for an electronic apparatus as claimed in  claim 1 , wherein the electronic substrate is set with other electronic devices. 
   
   
       4 . The refrigerant cooling system for an electronic apparatus as claimed in  claim 1 , wherein the input end is configured to input the near liquid state refrigerant 
   
   
       5 . The refrigerant cooling system for an electronic apparatus as claimed in  claim 1 , wherein the throttling device is any device being configured to cool the expanding liquid state refrigerant, such as an expansion valve, a capillary, or an orifice plate. 
   
   
       6 . The refrigerant cooling system for an electronic apparatus as claimed in  claim 1 , wherein the near liquid state refrigerant is provided by an external refrigerating system or a liquid refrigerant pump. 
   
   
       7 . The refrigerant cooling system for an electronic apparatus as claimed in  claim 1 , wherein the state of the refrigerant contained in the middle-temperature evaporator is at high temperature and under high pressure, and is in near liquid state. 
   
   
       8 . The refrigerant cooling system for an electronic apparatus as claimed in  claim 1 , wherein the number and the locations of the fans are variable to ensure flowing directions of the airflow is drawn into the low-temperature evaporator and drawn toward the middle-temperature evaporator. 
   
   
       9 . The refrigerant cooling system for an electronic apparatus as claimed in  claim 1 , wherein the number and the locations of the openings are variable to ensure flowing directions of the airflow is drawn into the low-temperature evaporator and drawn toward the middle-temperature evaporator. 
   
   
       10 . A refrigerant cooling method for an electronic apparatus, comprising the steps of:
 Step 1: Filling a near liquid state refrigerant into the input end pipe toward a middle-temperature evaporator for cooling an electronic substrate contacting with the middle-temperature evaporator;   Step 2: after the liquid-gaseous mixture state refrigerant carries away the heat from the electronic substrate, directing the refrigerant through an output end pipe with a throttling device being set thereon for second-stage expansion, then filling the liquid-gaseous mixture state refrigerant into a low-temperature evaporator for cooling the airflow drawn by a fan;   Step 3, after drawing the airflow into a enclosure by the fan, cooling the airflow by the low-temperature evaporator, and carrying out the heat from the electronic substrate and the other electronic devices by directing the airflow through the electronic substrate, then exhausting the airflow out of the enclosure via an opening;   Step 4, after heat exchange between the liquid-gaseous mixture state refrigerant contained in the evaporator and the airflow, flowing the refrigerant toward a receiver or a compressor of a refrigerating system via the output end pipe for a compression cycle in the cooling system.