Thermal Switch

Abstract

The invention concerns a thermal switch, characterized in that said switch comprises a thermal connection element consisting of an integral single part forming a body of thermally conductive homogeneous composition as well as an actuator for opening said switch by mechanical rupture of said thermal connection element.

1 - 13 . (canceled) 
   
   
       14 . A thermal switch comprising a thermal connection element that includes a one-piece component forming a heat-conducting body of homogeneous composition and an actuator capable of opening the switch by mechanically rupturing the thermal connection element. 
   
   
       15 . The thermal switch of  claim 14 , wherein the thermal connection element is mechanically resilient. 
   
   
       16 . The thermal switch of  claim 14 , wherein the thermal switch is suitable for being kept open by return means following mechanical rupture of the thermal connection element. 
   
   
       17 . The thermal switch of  claim 16 , wherein the return means are external to the thermal switch. 
   
   
       18 . The thermal switch of  claim 17 , wherein the external means comprises a heat-insulating connecting member. 
   
   
       19 . The thermal switch of  claim 18 , wherein the connecting member comprises a mechanical stop. 
   
   
       20 . The thermal switch of  claim 16 , wherein the return means comprises an elastic member connected to the thermal switch. 
   
   
       21 . The thermal switch of  claim 14 , wherein the thermal connection element is made of a corundum material. 
   
   
       22 . The thermal switch of  claim 21  wherein the corundum material is selected from sapphire and ruby. 
   
   
       23 . The thermal switch of  claim 14 , wherein the thermal connection element is made of a ceramic. 
   
   
       24 . The thermal switch of  claim 23 , wherein the ceramic is selected from silicon carbide and tungsten carbide. 
   
   
       25 . The thermal switch of  claim 14 , wherein the thermal connection element is made of a material selected from diamond, graphite, silicon, quartz, and glass. 
   
   
       26 . The thermal switch of  claim 14 , wherein the actuator is a piezoelectric component. 
   
   
       27 . The thermal switch of  claim 14 , wherein the thermal switch is utilized in a cooling system. 
   
   
       28 . The thermal switch of  claim 14 , wherein the thermal switch is utilized in a heating system. 
   
   
       29 . The thermal switch of  claim 14 , wherein the thermal switch is utilized in a ground based or on-board cryogenic cooling system. 
   
   
       30 . The thermal switch of  claim 14 , wherein the system is with redundancy. 
   
   
       31 . The thermal switch of  claim 14 , wherein the system is without redundancy.