Clip and heat sink assembly having the same

Abstract

A heat sink assembly includes a heat sink and a clip. The heat sink includes a base and a fin extending upwardly from the base. The clip is mounted on the fin and can be removed therefrom by moving upwardly along a height direction of the fin. The clip includes a resisting part contacting with a side of the fin, two locking parts respectively connected to two ends of the resisting part for securing the heat sink to a printed circuit board, and two stopping parts engaging with two opposites ends and an opposite side of the fin for preventing the clip from moving along widthwise and thickness directions of the fin. The two stopping parts are connected to the resisting part and located between the two locking parts.

1 . A clip adapted for securing a heat sink to a printed circuit board having a heat generating electronic device thereon, the heat sink comprising a base and a plurality of fins extending from a top surface of the base, the clip comprising:
 a resisting part adapted for contacting with a fin of the heat sink when the clip is mounted to the fin;   two locking parts respectively connected to two ends of the resisting part, and configured for securing the base of the heat sink to the printed circuit board when the clip is mounted to the fin; and   two stopping parts configured for preventing the clip from moving along a widthwise direction of the fin when the clip is mounted to the fin, the two stopping parts being connected to the resisting part and located between the two locking parts, the two stopping parts cooperating with the resisting part adapted to prevent the clip from moving along a thickness direction of the fin when the clip is mounted to the fin, the clip being adapted for being mountable to and removable from the fin along a height direction of the fin.   
     
     
         2 . The clip as claimed in  claim 1 , wherein the two locking parts are located at one of a same side or different sides of the resisting part. 
     
     
         3 . The clip as claimed in  claim 1 , wherein the two locking parts are perpendicularly connected to the two ends of the resisting part. 
     
     
         4 . The clip as claimed in  claim 1 , wherein the two stopping parts are located at one of a same side or different sides of the resisting part. 
     
     
         5 . The clip as claimed in  claim 4 , wherein the two stopping parts are respectively protruded and bent from two portions of the resisting part. 
     
     
         6 . The clip as claimed in  claim 1 , wherein each of the two stopping parts comprises a connection section and a stopping section connecting to the connection section, the connection section being perpendicular to the resisting part. 
     
     
         7 . The clip as claimed in  claim 6 , wherein the resisting part comprises a resisting surface adapted for contacting with the fin, a bottom surface adapted for contacting with the top surface of the base, and two end surfaces. 
     
     
         8 . The clip as claimed in  claim 7 , wherein two cutouts are opened from the bottom surface of the resisting part and located near the two end surfaces, respectively, each cutout is defined by two first surfaces parallel with the two end surfaces and a second surface interconnected between the two first surfaces. 
     
     
         9 . The clip as claimed in  claim 8 , wherein the two connection sections of the two stopping parts are respectively bent and protruded from the two first surfaces near the end surfaces. 
     
     
         10 . The clip as claimed in  claim 8 , wherein each of the two locking parts comprises a bending section connected to the bottom surface, and a locking section adapted to engage with the printed circuit board. 
     
     
         11 . The clip as claimed in  claim 10 , wherein one end of the bending section of each of the two locking parts is connected to one end surface, and another other end thereof is connected to a corresponding first surface near the one end surface. 
     
     
         12 . A heat sink assembly adapted for dissipating heat generated by a heat generating electronic device on a printed circuit board, the heat sink assembly comprising:
 a heat sink comprising a base and a fin array extending from a top surface of the base; and   at least one clip removably mounted on at least one fin in the fin array, the at least one clip comprising:   a resisting part contacting with a side of the at least one fin;   two locking parts respectively connected to two ends of the resisting part, and configured for securing the base of the heat sink to the printed circuit board; and   two stopping parts engaging with opposite ends of the at least one fin for preventing the at least one clip from moving along a widthwise direction of the at least one fin, the two stopping parts being connected to the resisting part and located between the two locking parts, the two stopping parts also contacting with an opposite side of the at least one fin for preventing the at least one clip from moving along a thickness direction of the at least one fin, the at least one clip being removable from the at least one fin by moving upwardly along a height direction of the at least one fin.   
     
     
         13 . The heat sink assembly as claimed in  claim 12  further comprising another clip, the at least one clip and the another clip being removably mounted on two symmetrical fins of the fin array. 
     
     
         14 . The heat sink assembly as claimed in  claim 13 , wherein the at least one clip and the another clip are removably mounted on two outermost fins of the fin array. 
     
     
         15 . The heat sink assembly as claimed in  claim 14 , wherein each of the two stopping parts comprises a connection section and a stopping section connecting to the connection section, the connection section being bent and protruded from the resisting part. 
     
     
         16 . The heat sink assembly as claimed in  claim 15 , wherein the resisting part comprises a resisting surface contacting with the side of the at least one fin of the fin array, a bottom surface contacting with the top surface of the base, and two end surfaces. 
     
     
         17 . The heat sink assembly as claimed in  claim 16 , wherein two cutouts are opened from the bottom surface of the resisting part and located near the two end surfaces, respectively, and each cutout is defined by two first surfaces parallel with the two end surfaces and a second surface interconnected between the two first surfaces. 
     
     
         18 . The heat sink assembly as claimed in  claim 17 , wherein the two connection sections of the two stopping parts are respectively bent and protruded from the two first surfaces near the end surfaces. 
     
     
         19 . The heat sink assembly as claimed in  claim 18 , wherein each of the two locking parts comprises a bending section connected to the bottom surface, and a locking section adapted to engage with the printed circuit board. 
     
     
         20 . The heat sink assembly as claimed in  claim 19 , wherein one end of the bending section of each of the two locking parts is connected to one end surface, and another other end thereof is connected to a corresponding first surface near the one end surface.