Electrostatic chuck

Abstract

An electrostatic chuck ( 8 ) includes a dielectric board ( 14 ) having an upper surface on which a plurality of projections ( 17 a ) for supporting a substrate on top surfaces and recesses ( 17 b ) surrounding the projections ( 17 a ) are formed, an electrode ( 15 ) formed inside the dielectric board ( 14 ), and an external power supply ( 15 ) which applies a voltage to the electrode ( 15 ). The dielectric board ( 14 ) includes a conductor film ( 19 ) formed on at least the top surface of each projection ( 17 a ), and has a three-dimensional structure which causes the conductor film ( 19 ) to generate a Johnson-Rahbeck force between the substrate ( 9 ) and conductor film ( 19 ) when a voltage is applied to the electrode ( 15 ).

1 . A sputtering apparatus including
 a vessel which is configured to be evacuated by an external evacuating mechanism,   a target arranged in said vessel and connected to a sputtering power supply which applies a voltage,   a magnet fixed to a lower surface side of said target, and   an electrostatic chuck arranged in a position facing an upper surface side of said target and configured to support a substrate thereon,   wherein said electrostatic chuck comprises a dielectric board having an upper surface formed with a plurality of projections for supporting the substrate on top surfaces thereof and recesses around the projections, and an electrode formed in said dielectric board and receiving a voltage from an external power supply,   said dielectric board comprises a conductor film formed on at least the top surface of each projection, and   the top surface of each projection having said conductor film has a three-dimensional pattern whose Ry (maximum surface roughness) is not more than 2.5 m and Ra (central line average roughness) is not more than 0.25 m.