US2010101763A1PendingUtilityA1

Thin heat dissipating apparatus

40
Assignee: HUANG MENG-CHENGPriority: Oct 27, 2008Filed: Oct 27, 2008Published: Apr 29, 2010
Est. expiryOct 27, 2028(~2.3 yrs left)· nominal 20-yr term from priority
H10W 40/43H10W 40/73G06F 1/203F28D 15/0233F28D 15/0275
40
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

A heat dissipating apparatus includes a heat pipe, a heat dissipating element, and two heat conducting bases. The pipe body of the heat pipe is formed integrally and has two evaporation ends disposed on both distal ends of the pipe body respectively and a condensation section disposed at a portion of the pipe body for installing the heat dissipating element on the condensation section, and the two heat conducting bases are disposed on the two evaporation ends respectively, such that the invention simply requires connecting the heat dissipating element with the single heat pipe to achieve the effect of reducing the volume or space occupied by the heat dissipating element.

Claims

exact text as granted — not AI-modified
1 . A thin heat dissipating apparatus, comprising;
 a heat pipe, being integrally formed with a pipe body, and having two evaporation ends disposed at distal ends of the heat pipe respectively and a condensation section disposed at a portion of the pipe body;   a heat dissipating element, installed at the condensation section of the heat pipe; and   two heat conducting bases, disposed on the two evaporation ends of the heat pipe respectively.   
   
   
       2 . The thin heat dissipating apparatus of  claim 1 , wherein the pipe body of the heat pipe disposed at the two evaporation ends and at the condensation section is in a flat shape. 
   
   
       3 . The thin heat dissipating apparatus of  claim 2 , wherein the pipe body of the heat pipe is in a flat shape at the remaining portion. 
   
   
       4 . The thin heat dissipating apparatus of  claim 1 , wherein the pipe body of the heat pipe is in a circular tubular shape. 
   
   
       5 . The thin heat dissipating apparatus of  claim 1 , wherein the heat dissipating element is a stacked heat dissipating device formed by arranging a plurality of fins transversally. 
   
   
       6 . The thin heat dissipating apparatus of  claim 5 , wherein each fin includes a through hole for passing through the condensation section of the heat pipe to install the heat dissipating element on the condensation section. 
   
   
       7 . The thin heat dissipating apparatus of  claim 5 , wherein each fin includes an indent concavely disposed on a lateral edge of the fin, and having a shape matched precisely with the shape of the surface of the pipe body of the heat pipe, and the indents are used for forming an indent portion, and the indent portion is in contact with a surface of the condensation section of the heat pipe. 
   
   
       8 . The thin heat dissipating apparatus of  claim 7 , wherein the heat dissipating element is disposed on the first half of the surface of the condensation section. 
   
   
       9 . The thin heat dissipating apparatus of  claim 8 , further comprising another heat dissipating element disposed at a lower half of a surface of the condensation section. 
   
   
       10 . The thin heat dissipating apparatus of  claim 1 , wherein the two heat conducting bases have a groove disposed thereon for embedding the evaporation end of the heat pipe, such that the two heat conducting bases are disposed on the two evaporation ends respectively. 
   
   
       11 . The thin heat dissipating apparatus of  claim 1 , further comprising a heat dissipating fan for providing a heat driving effect for the heat dissipating element. 
   
   
       12 . The thin heat dissipating apparatus of  claim 11 , wherein the heat dissipating fan is a centrifugal fan.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.