Heat sink system with fin structure

Abstract

A heat sink apparatus includes a heat conductive base plate and a plurality of fins in thermal communication with the heat conductive base plate. The plurality of fins is configured to form a plurality of curved and branching channels extending radially on the base plate. At least two of the plurality of fins are configured with a gap between them to trip a gas boundary layer formed on a first one of the at least two fins, when a gas boundary layer is present.

1 . A heat sink apparatus, comprising:
 a heat conductive base plate; and   a plurality of fins in thermal communication with said heat conductive base plate, said plurality of fins configured to form a plurality of curved and branching channels extending radially on said base plate, at least two of said plurality of fins configured with a gap between them to trip a boundary layer formed on a first one of said at least two fins, when a boundary layer is present.   
   
   
       2 . The apparatus of  claim 1 , wherein at least one of said plurality of fins comprises a plurality of pin fins. 
   
   
       3 . The apparatus of  claim 1 , wherein said plurality of fins have respective fin heights that increase radially outward to provide a more uniform base plate temperature when used as a heat sink. 
   
   
       4 . The apparatus of  claim 1 , wherein said gap extends substantially across the height of said at least one of said plurality of fins. 
   
   
       5 . The apparatus of  claim 1 , further comprising a plurality of concave dimples configured on an upper surface of said heat conductive based plate to introduce a vortex flow on the said upper surface, when a flow is present. 
   
   
       6 . A heat sink apparatus, comprising:
 a heat conductive base plate;   first and second curved fins in thermal communication with said heat conductive base plate, said first and second curved fins forming a first channel inlet to receive a flow of gas for heat transfer;   a third curved fin positioned between said first and second curved fins and extending from a position on said heat conductive base plate set back from said first channel inlet, said first curved fin and a proximal end of said third curved fin establishing a second channel inlet to receive a portion of the flow of gas for heat transfer; and   a fourth curved fin positioned between said first and third curved fins and extending from a position on said heat conductive base plate set back from said second channel inlet, said first curved fin and a proximal end of said fourth curved fin forming a third channel inlet to receive a portion of the flow of gas for heat transfer;   wherein said first, second, third and fourth fins establish a plurality of branching and curved channels to receive a gas flow and to induce primary and secondary gas flow for increased heat transfer at a reduced pressure drop between said first and third channel inlets.   
   
   
       7 . The apparatus of  claim 6 , further comprising:
 a fifth curved fin positioned between said first and fourth curved fins and extending from a position on said heat conductive base plate set back from said third channel inlet, said first curved fin and a proximal end of said fifth curved fin forming a fourth channel inlet to receive a portion of the flow of gas for heat transfer at a reduced pressure drop between said first and fourth channel inlets.   
   
   
       8 . The apparatus of  claim 6 , wherein at least one of said first, second and third curved fins comprises a plurality of fin segments to trip a gas boundary layer at each respective fin gap. 
   
   
       9 . The apparatus of  claim 6 , wherein at least one of said first, second and third curved fins comprises a plurality of pin fins to trip a gas boundary layer at each respective pin gap. 
   
   
       10 . The apparatus of  claim 6 , wherein at least one of said first, second and third curved fins have a fin height that increases radially outward to provide more uniformity of base plate temperature. 
   
   
       11 . The apparatus of  claim 10 , further comprising a plurality of concave dimples configured on an upper surface of said heat conductive based plate to introduce a vortex flow on the said upper surface, when a flow is present. 
   
   
       12 . A heat sink system, comprising:
 a heat conductive base plate;   a fin structure in thermal communication with said base plate, said fin structure having a plurality of curved branching channels, said plurality of curved branching channels having a first tier channel inlet;   a fan positioned in complementary opposition to said first tier channel inlet to provide a flow of air.   
   
   
       13 . The system of  claim 12 , further comprising a metering port positioned between said first tier channel inlet and said fan to redirect air towards said first tier channel inlet. 
   
   
       14 . The system of  claim 12 , further comprising a directing port positioned between said first tier channel inlet and said fan to redirect air towards said first tier channel inlet. 
   
   
       15 . The system of  claim 12 , wherein said curved branching channels comprise a plurality of curved fins. 
   
   
       16 . The system of  claim 15 , wherein at least one of said curved fins comprises a plurality of fin segments to trip a gas boundary layer at each respective fin segment intersection. 
   
   
       17 . The system of  claim 15 , wherein at least one of said curved fins comprises a plurality of pins to trip a gas boundary layer at each respective pin intersection. 
   
   
       18 . The apparatus of  claim 15 , further comprising a plurality of concave dimples configured on an upper surface of said heat conductive based plate to introduce a vortex flow on the said upper surface, when a flow is present. 
   
   
       19 . A method of cooling a heat conductive base plate, including:
 conducting heat from a heat conductive base plate to a plurality of curved fins;   blowing air onto a face of said heat conductive base plate;   directing said air through at least one first-tier channel established by said plurality of curved fins to induce primary and vortex flow patterns;   directing said air through a plurality of second-tier branching channels established by said plurality of curved fins to reduce buildup of back pressure as said air moves across said heat conductive base plate adjacent to said curved fins; and   passing said air across gaps formed in said plurality of curved fins to trip a developing thermal boundary layer.   
   
   
       20 . The method of  claim 19 , further comprising:
 passing said air across concave dimples formed on a surface of said heat conductive base plate to trip a developing thermal boundary layer.   
   
   
       21 . The method of  claim 19 , further comprising:
 passing said air across a plurality of concave dimples formed on at least one of said plurality of curved fins to trip a developing thermal boundary layer.