Heat pipe with planished end surface

Abstract

The invention is to provide a heat pipe that has a planished end surface, and thereby an electronic device can be flatly mounted on the planished end surface of the sealed end of the heat pipe. The heat pipe includes a sealed metal pipe and a porous capillary diversion layer. The metal pipe has a space in vacuum, a working fluid is in the space, wherein the planished end surface is formed on the outer wall of an sealed end of the metal pipe. The porous capillary diversion layer is disposed in the space, and it covers and includes the inner wall of the sealed end of the metal pipe.

1 . A heat pipe having a planished end surface using the end surface flatten process, thereby an electronic device flatly being mounted on the planished surface of the heat pipe, the heat pipe comprising:
 a sealed metal pipe having a space in vacuum, a working fluid being in the space, wherein the planished surface being formed at the outer wall of a sealed end of the metal pipe; and   a porous capillary diversion layer disposed in the space and covers and comprises the inner wall of the sealed end of the metal pipe.   
   
   
       2 . The heat pipe of  claim 1 , wherein the planished end surface of the sealed metal pipe is formed by a sealed end of the metal pipe through a stamping process. 
   
   
       3 . The heat pipe of  claim 1 , wherein the shape of the planished end surface is tabular or fluted. 
   
   
       4 . The heat pipe of  claim 1 , wherein the porous capillary diversion layer is sintered by a copper powder, a nickel powder, a silver powder, a metal powder which surface is plated with copper, nickel or silver, or other similar metal powder. 
   
   
       5 . The heat pipe of  claim 1 , wherein the sealed metal pipe is made of a copper metal, a nickel metal, a silver metal, or other similar metal materials. 
   
   
       6 . The heat pipe of  claim 1 , wherein the electronic device is one selected from the group consisting of a light emitting diode, a laser diode, and an integrated circuit.