Connecting microsized devices using ablative films

Abstract

A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.

1 . An apparatus comprising:
 (a) an ablative base material having at least a top surface;   (b) a die with at least a first surface of the die contacting at least a first surface of the ablative base material; and   (c) a channel disposed in the ablative material proximate to, but not facing the die.   
     
     
         2 . The apparatus in  claim 1  further comprising a conductive and wickable fluid in the ablated channel to provide contact to portions of the die by the wicking of the fluid. 
     
     
         3 . The apparatus of  claim 1 , wherein the channel is aligned the pre-positioned microdevice. 
     
     
         4 . The apparatus of  claim 1 , wherein the conductive material is a fluid. 
     
     
         5 . The apparatus of  claim 1 , wherein the conductive material is an electrical conductor. 
     
     
         6 . The apparatus of  claim 1 , wherein the conductive material is a magnetic material. 
     
     
         7 . The apparatus of  claim 1 , wherein the conductive material conveys light. 
     
     
         8 . The apparatus of  claim 1 , wherein the conductive material is responsive to sound or motion. 
     
     
         9 . The apparatus of  claim 1  further comprising structures on the microsized devices to facilitate fluidic, electrical, photonic, and mechanical connections to the devices.