Connecting microsized devices using ablative films

Abstract

A method of providing connectivity to a microsized device, the method includes the steps of providing an ablative base material having at least a top surface; providing a die having a first and second surface and having bonding pads at least upon the first surface; placing the die with the at least first surface of the die contacting the at least first surface of the ablative base material; and ablating a channel in the ablative material proximate to the die.

1 . A method of providing connectivity to a microsized device, the method comprising the steps of:
 (a) providing an ablative base material having at least a top surface;   (b) providing a die having a first and second surface and having bonding pads at least upon the first surface;   (c) placing the die with the at least first surface of the die contacting the at least top surface of the ablative base material; and   (d) ablating a channel in the ablative material proximate to, but not facing the die following placement of the die on the top surface of the ablative base material.   
     
     
         2 . The method as in  claim 1  further comprising the step of placing a material in the ablated channel to provide a connective material therein. 
     
     
         3 . The method as in  claim 1  further comprising the step of placing a fluid in the ablated channel to provide contact to portions of the die by the wicking of the fluid. 
     
     
         4 . The method as in  claim 1  further comprising a support structure on the microsized device to control fluid wicking. 
     
     
         5 . The method of  claim 1  further comprising the steps of;
 (a) determining a position of the placed microdevice and storing results; and   (b) causing the ablative channel to align to the pre-positioned microdevice.   
     
     
         6 . The method of  claim 2 , wherein the material filling the channel is a fluid. 
     
     
         7 . The method of  claim 2 , wherein the material filling the channel provides electrical connection(s) to the die. 
     
     
         8 . The method of  claim 2 , wherein the material filling the channel is a magnetic material. 
     
     
         9 . The method of  claim 2 , wherein the material filling the channel conveys light. 
     
     
         10 . The method of  claim 2 , wherein the material filling the channel is responsive to sound or motion. 
     
     
         11 . The method of  claim 1  including providing structures on the microsized devices to facilitate fluidic, electrical, photonic, and mechanical connections to the devices.