Heat dissipation device

Abstract

A heat dissipation device includes a plurality of fins stacked together, a plurality of heat pipes extending through the fins, and solder filled in gaps between the fins and the heat pipes. Each fin includes a plate defining a plurality of holes therein for extension of the heat pipes therethrough, respectively. A collar extends from a periphery of each of the holes. The collar includes a columned portion attached to an outer surface of each of the heat pipes, and a taper portion interconnecting the plate and the columned portion. The solder fills in a gap between the columned portion and a corresponding heat pipe and a space between the taper portion and the corresponding heat pipe. The collar has a height slightly smaller than a distance between two adjacent fins.

1 . A heat dissipation device comprising:
 a heat pipe; and   a plurality of fins stacked onto the heat pipe along an axial direction of the heat pipe, each fin comprising a plate defining a hole for extension of the heat pipe therethrough and a collar extending from a periphery of the hole, the collar comprising a columned portion attached to an outer surface of the heat pipe, and a taper portion interconnecting the plate and the columned portion, the taper portion increasing a height of the collar along the axial direction of the heat pipe.   
   
   
       2 . The heat dissipation device as claimed in  claim 1 , wherein the height of the collar is slightly smaller than a distance between two adjacent fins. 
   
   
       3 . The heat dissipation device as claimed in  claim 1 , wherein a height of the columned portion is similar to that of the taper portion. 
   
   
       4 . The heat dissipation device as claimed in  claim 1 , wherein the taper portion has a truncated cone configuration, with a small bottom thereof connecting a top of the columned portion, and a big top thereof connecting the plate. 
   
   
       5 . The heat dissipation device as claimed in  claim 1 , further comprising solder filled in gaps between the collars of the fins and the heat pipe. 
   
   
       6 . The heat dissipation device as claimed in  claim 5 , wherein the taper portion has an inner surface facing towards the outer surface of the heat pipe and a portion of the solder is retained between the inner surface of the taper portion and the outer surface of the heat pipe. 
   
   
       7 . The heat dissipation device as claimed in  claim 1 , further comprising thermally conductive glue filled in gaps between the collars of the fins and the heat pipe. 
   
   
       8 . A heat dissipation device comprising:
 at least one heat pipe;   a plurality of fins stacked onto the at least one heat pipe along an axial direction of the at least one heat pipe, with a channel defined between every two adjacent fins, each fin comprising a plate defining at least one hole for extension of the at least one heat pipe therethrough and a collar extending from a periphery of the at least one hole, the collar comprising a columned portion attached to an outer surface of the heat pipe, and a taper portion interconnecting the plate and the columned portion, a height of the collar being slightly smaller than a height of the channel; and   solder filled in gaps between the collars of the fins and the at least one heat pipe, the solder filling in a gap between the columned portion and the at least one heat pipe and a space between the taper portion and the at least one heat pipe.   
   
   
       9 . The heat dissipation device as claimed in  claim 8 , wherein the columned portion is cylindrical, and the taper portion has a truncated cone shape, with a small bottom thereof connecting a top of the columned portion, and a big top thereof connecting the plate. 
   
   
       10 . The heat dissipation device as claimed in  claim 8 , wherein a height of the columned portion is similar to that of the taper portion. 
   
   
       11 . A heat dissipation device comprising:
 at least one heat pipe;   a plurality of fins stacked onto the at least one heat pipe along an axial direction of the at least one heat pipe, each fin comprising a plate defining at least one hole for extension of the at least one heat pipe therethrough and a collar extending from a periphery of the at least one hole, the collar comprising a contacting portion attached to an outer surface of the at least one heat pipe, and an intermediate portion interconnecting the plate and the contacting portion, a cross section of the intermediate portion being larger than that of the contacting portion; and   solder filled in gaps between the collars of the fins and the at least one heat pipe, the solder filling in a gap between the contacting portion and the at least one heat pipe and a space between the intermediate portion and the at least one heat pipe.   
   
   
       12 . The heat dissipation device as claimed in  claim 11 , wherein the contacting portion has a columned shape for enclosing the outer surface of the at least one heat pipe, and the intermediate portion has a taper shape with a small bottom thereof connecting a top of the contacting portion, and a big top thereof connecting the plate. 
   
   
       13 . The heat dissipation device as claimed in  claim 11 , wherein a height of the collar approaches to a distance between two adjacent fins. 
   
   
       14 . The heat dissipation device as claimed in  claim 11 , wherein a height of the contacting portion is similar to that of the retaining portion.