Positive photosensitive resin composition and dpolyhydroxyamide resin

Abstract

There is provided a positive photosensitive resin composition that is excellent in electric insulating properties, heat resistance, mechanical strength and electrical characteristics, and capable of forming a high-resolution circuit pattern. The positive photosensitive resin composition comprises at least one type of a polyhydroxyamide resin containing a repeating unit represented by Formula (1) and having a weight average molecular weight of 3,000 to 100,000, and a compound generating an acid by light irradiation. (where X represents a tetravalent aliphatic group or an aromatic group; R 1 and R 2 independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atom(s); Ar 1 and Ar 2 independently represent an aromatic group; Y represents an organic group containing an aromatic group substituted with at least one OH group; n represents an integer of 1 or more; and l and m independently represent an integer of 0 or 1 or more and satisfy l+m≦2).

1 . A positive photosensitive resin composition comprising:
 at least one type of a polyhydroxyamide resin (A) containing a repeating unit represented by Formula (1):   
     
       
         
         
             
             
         
       
     
     (where X represents a tetravalent aliphatic group or an aromatic group;
 R 1  and R 2  independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atom(s); 
 Ar 1  and Ar 2  independently represent an aromatic group; 
 Y represents an organic group containing an aromatic group substituted with at least one OH group; 
 n represents an integer of 1 or more; and 
 l and m independently represent an integer of 0 or 1 or more and satisfy l+m≦2) and having a weight average molecular weight of 3,000 to 100,000; and 
 a compound (B) generating an acid by light irradiation. 
 
   
   
       2 .- 4 . (canceled) 
   
   
       5 . The positive photosensitive resin composition according to  claim 1 , wherein in Formula (1), a group: 
     
       
         
         
             
             
         
       
     
     has a structure represented by Formula (2): 
     
       
         
         
             
             
         
       
     
     (where Ar 1 , Ar 2 , Y, l and m represent the same meaning as defined above; and
 R 3  to R 6  independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atom(s)). 
 
   
   
       6 . The positive photosensitive resin composition according to  claim 1 , wherein the Ar 1  and the Ar 2  independently represent a benzene ring. 
   
   
       7 . The positive photosensitive resin composition according to  claim 6 , wherein the —Ar 1 (OH), group and the —Ar 2 (OH) m  group have a structure represented by Formula (3): 
     
       
         
         
             
             
         
       
     
     (where R 7  to R 10  independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phosphonyl group, a sulfonyl group, a phenyl group which is optionally substituted with W 1 , a naphthyl group which is optionally substituted with W 1 , a thienyl group which is optionally substituted with W 1  or a furyl group which is optionally substituted with W 1 ; and W 1  represents an alkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), a hydroxy group, a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phosphonyl group or a sulfonyl group). 
   
   
       8 . The positive photosensitive resin composition according to  claim 1 , wherein the Y represents an organic group containing a benzene ring substituted with at least one OH group. 
   
   
       9 . The positive photosensitive resin composition according to  claim 8 , wherein the Y represents an organic group containing two or more benzene rings substituted with at least one OH group. 
   
   
       10 . The positive photosensitive resin composition according to  claim 9 , wherein the Y has a structure represented by Formula (4): 
     
       
         
         
             
             
         
       
     
     (where R 11  to R 16  independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), a hydroxy group, a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phosphonyl group, a sulfonyl group, a phenyl group which is optionally substituted with W 2 , a naphthyl group which is optionally substituted with W 2 , a thienyl group which is optionally substituted with W 2  or a furyl group which is optionally substituted with W 2 ;
 W 2  represents an alkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), a hydroxy group, a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phosphonyl group or a sulfonyl group; 
 Z 1  represents a single bond, an alkylene group having 1 to 10 carbon atom(s) which is optionally substituted with W 3 , —C(O)O—, —C(O)NH—, —O—, —S—, —S(O) 2 — or —C(O)—; and W 3  represents an alkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s) or an alkoxy group having 1 to 10 carbon atom(s)). 
 
   
   
       11 . (canceled) 
   
   
       12 . The positive photosensitive resin composition according to  claim 1 , wherein the polyhydroxyamide resin further contains at least one type of a repeating unit represented by Formula (5): 
     
       
         
         
             
             
         
       
     
     (where X, Ar 1 , Ar 2 , R 1 , R 2 , l and m represent the same meaning as defined above;
 Q represents a divalent organic group (with a proviso that the group contains no OH group); and 
 p represents an integer of 1 or more). 
 
   
   
       13 .- 20 . (canceled) 
   
   
       21 . The positive photosensitive resin composition according to  claim 1 , wherein the polyhydroxyamide resin further contains at least one type of a repeating unit represented by Formula (9): 
     
       
         
         
             
             
         
       
     
     (where X, Ar 1 , Ar 2 , R 1 , R 2 , l and m represent the same meaning as defined above;
 R 52  to R 56  independently represent a hydrogen atom, an alkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s), an alkoxy group having 1 to 10 carbon atom(s), a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phosphonyl group, a sulfonyl group, a phenyl group which is optionally substituted with W 6 , a naphthyl group which is optionally substituted with W 6 , a thienyl group which is optionally substituted with W 6  or a furyl group which is optionally substituted with W 6 ; 
 W 6  represents an alkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s); an alkoxy group having 1 to 10 carbon atom(s), a hydroxy group, a halogen atom, a nitro group, a formyl group, a cyano group, a carboxyl group, a phosphonyl group or a sulfonyl group; 
 Z 8  to Z 10  independently represent a single bond, an alkylene group having 1 to 10 carbon atom(s) which is optionally substituted with W 7 , —C(O)O—, —C(O)NH—, —O—, —S—, —S(O) 2 — or —C(O)—; 
 W 7  represents an alkyl group having 1 to 10 carbon atom(s), a haloalkyl group having 1 to 10 carbon atom(s) or an alkoxy group having 1 to 10 carbon atom(s); and q represents an integer of 1 or more). 
 
   
   
       22 .- 26 . (canceled) 
   
   
       27 . A positive photosensitive resin composition-containing varnish wherein the positive photosensitive resin composition according to  claim 1  is dissolved in at least one type of a solvent. 
   
   
       28 . A cured film produced by using the positive photosensitive resin composition according to  claim 1 . 
   
   
       29 . A cured film produced by using the positive photosensitive resin composition-containing varnish according to  claim 27 . 
   
   
       30 . A structure comprising:
 at least one layer formed by the cured film according to  claim 28  on a substrate.   
   
   
       31 . A polyhydroxyamide resin containing a repeating unit represented by Formula (10): 
     
       
         
         
             
             
         
       
     
     (where X represents a tetravalent aliphatic group or an aromatic group;
 R 1  and R 2  independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atom(s); 
 Ar 1  and Ar 2  independently represent an aromatic group; 
 Y represents an organic group containing an aromatic group substituted with at least one OH group; 
 n represents an integer of 1 or more; and 
 l and m independently represent an integer of 0 or 1 or more and satisfy l+m≦2), 
 and having a weight average molecular weight of 3,000 to 100,000. 
 
   
   
       32 .- 53 . (canceled)