Mix of grafted and non-grafted particles in a resin

Abstract

In one application the mix grafted and non grafted invention provides for high thermal conductivity resin that comprises a host resin matrix 32 with a first class of grafted 31 high thermal conductivity particles that are grafted to the host resin matrix. Also a second class of non-grafted 30 high thermal conductivity particles that are not directly grafted the host resin matrix 32 . The first class and the second class comprise approximately 2-60% by volume of the high thermal conductivity resin. The first class of grafted particles and the second class of non-grafted particles are high thermal conductivity fillers are from 1-1000 nm in length, and have an aspect ratio of between 3-100.

1 .- 22 . (canceled) 
   
   
       23 . A high thermal conductivity resin comprising:
 a host resin matrix;   a first class of grafted high thermal conductivity particles that are grafted to said host resin matrix; and   a second class of non-grafted high thermal conductivity particles that are not directly grafted said host resin matrix;   wherein said first class and said second class comprise approximately 2-60% by volume of said high thermal conductivity resin;   wherein said first class of grafted particles and said second class of non-grafted particles are high thermal conductivity fillers are from 1-1000 nm in length, and have an aspect ratio of between 3-100.   
   
   
       24 . The resin of  claim 23 , wherein said first class and said second class comprise approximately 25-40%. 
   
   
       25 . The resin of  claim 23 , wherein said second class of non-grafted particles have been surface treated to not react with other particles with their class. 
   
   
       26 . The resin of  claim 23 , wherein said second class of non-grafted particles have been surface treated to react with other particles with their class to form aggregations within the host resin matrix. 
   
   
       27 . The resin of  claim 23 , wherein said first class of grafted particles have been surface treated to react with said second class of non-grafted particles. 
   
   
       28 . The resin of  claim 23 , wherein said first class of grafted particles have an average length distribution at least ten times greater than said second class of non-grafted particles. 
   
   
       29 . The resin of  claim 23 , wherein said host resin network includes epoxy, polyimide epoxy, liquid crystal epoxy, cyanate-ester, polybutadiene, and mixtures thereof. 
   
   
       30 . The resin of  claim 23 , wherein high thermal conductivity resin is impregnated into a composite tape. 
   
   
       31 . The resin of  claim 31 , wherein said second class of non-grafted particles are incorporated into said high thermal conductivity resin after said high thermal conductivity resin is impregnated into said composite tape. 
   
   
       32 . The resin of  claim 23 , wherein non grafted becomes grafted to said host resin by the application of at least one of increased temperature and ultraviolet light. 
   
   
       33 . The resin of  claim 23 , wherein the thermal conductivity particles are at least one of oxides, nitrides, and carbides. 
   
   
       34 . A high thermal conductivity resin comprising:
 a host resin matrix;   a first class of grafted high thermal conductivity particles that are grafted to said host resin matrix; and   a second class of non-grafted high thermal conductivity particles that are not grafted to said host resin matrix;   wherein said first class and said second class comprise approximately 4-60% by volume of said high thermal conductivity resin;   wherein said first class of grafted particles and said second class of non-grafted particles are high thermal conductivity fillers are from 5-1000 nm in length, and have an aspect ratio of between 3-100;   wherein each of said classes of particles comprises at least 1% by volume of high thermal conductivity resin.   
   
   
       35 . The resin of  claim 34 , wherein the resin is impregnated into a porous media. 
   
   
       36 . The resin of  claim 35 , wherein the porous media is a paper matrix. 
   
   
       37 . The resin of  claim 35 , wherein the ratios of said first class of grafted particles and said second class of non-grafted particles are different in different parts of said porous media due to a greater filtering effect that the porous media has on said second class of non-grafted particles. 
   
   
       38 . The resin of  claim 35 , wherein the ratios of said first class of grafted particles and said second class of non-grafted particles are different in different parts of said porous media due to the original positioning of the particles. 
   
   
       39 . The resin of  claim 34 , wherein said first class of grafted particles have a higher mechanical strength than said second class of non-grafted particles. 
   
   
       40 . A high thermal conductivity resin comprising:
 a host resin matrix;   a first class of grafted particles that are grafted to said host resin matrix, wherein said grafted particles increase the local strength of said host resin matrix; and   a second class of non-grafted high thermal conductivity particles that are not grafted to said host resin matrix;   wherein said first class and said second class comprise approximately 2-60% by volume of said high thermal conductivity resin;   wherein said class of non-grafted particles are high thermal conductivity fillers are from 1-1000 nm in length, and have an aspect ratio of between 3-100.   
   
   
       41 . The resin of  claim 40 , wherein said second class of non-grafted particles have an average length of 2-10 times that of said first class of grafted particles. 
   
   
       42 . The resin of  claim 40 , wherein at least a portion of said first class of grafted particles are high thermal conductivity fillers from 1-1000 mu in length, and have an aspect ratio of between 3-100. 
   
   
       43 . The resin of  claim 40 , wherein a third class of non-grafted particles that are not high thermal conductivity particles are present in said host resin matrix. 
   
   
       44 . The resin of  claim 40 , wherein said grafted particles increase the dielectric strength of said host resin matrix.