Cooling device for electronic components

Abstract

A cooling device ( 10 ) including a chamber having an evaporator section ( 34 ) and a condenser section, the condenser section extending from a periphery of the evaporator section ( 34 ).

1 . A cooling device, comprising: a chamber having an evaporator section and a condenser section, the condenser section extending from a periphery of the evaporator section. 
   
   
       2 . The cooling device according to  claim 1 , wherein the condenser section comprises a plurality of condenser fins extending from the periphery of the evaporator section. 
   
   
       3 . The cooling device according to  claim 2 , further comprising a plurality of convective fins extending from surfaces of the condenser fins. 
   
   
       4 . The cooling device according to  claim 3 , wherein the convective fins extend between adjacent ones of the condenser fins. 
   
   
       5 . The cooling device according to  claim 4 , further comprising a fan arranged to direct a flow of air at the convective fins. 
   
   
       6 . The cooling device according to  claim 5 , further comprising an air guide arranged to direct the flow of air from the fan to the convective fins. 
   
   
       7 . The cooling device according to  claim 3 , wherein the convective fins are integrally moulded to the surfaces of the condenser fins. 
   
   
       8 . The cooling device according to  claim 1 , further comprising a capillary element arranged to facilitate return of condensate from the condenser section to the evaporator section. 
   
   
       9 . The cooling device according to  claim 1 , wherein a base portion of the condenser section is at an angle to a base portion of the evaporator section. 
   
   
       10 . The cooling device according to  claim 1 , wherein the evaporator section has a capillary structure. 
   
   
       11 . The cooling device according to  claim 10 , wherein the capillary structure comprises an open cell foam metal. 
   
   
       12 . The cooling device according to  claim 11 , wherein the open cell foam metal is bonded to a base portion of the evaporator section by diffused bonding or brazing. 
   
   
       13 . The cooling device according to  claim 10 , wherein the capillary structure has a pore density of from about 8 to about 52 pores per centimetre (ppc). 
   
   
       14 . The cooling device according to  claim 13 , wherein the pore density of the capillary structure is about 16 ppc. 
   
   
       15 . The cooling device according to  claim 1 , further comprising a working fluid arranged to absorb and transfer heat energy. 
   
   
       16 . The cooling device according to  claim 15 , wherein the working fluid has a latent heat of vaporisation of greater than or equal to about 1500 joules per gram (J/g). 
   
   
       17 . The cooling device according to  claim 15 , further comprising a plurality of nanoparticles in working fluid, the nanoparticles having a thermal conductivity of between about 200 Watt per metre Kelvin (W/m·K) to about 400 W/m·K.