Method for fabrication of low-polarization implantable stimulation electrode
Abstract
A method for fabricating an implantable medical electrode includes roughening the electrode substrate, applying an adhesion layer, and depositing a valve metal oxide coating over the adhesion layer under conditions optimized to minimize electrode impedance and post-pulse polarization. The electrode substrate may be a variety of electrode metals or alloys including titanium, platinum, platinum-iridium, or niobium. The adhesion layer may be formed of titanium or zirconium. The valve metal oxide coating is a ruthenium oxide coating sputtered onto the adhesion layer under controlled target power, sputtering pressure, and sputter gas ratio setting optimized to minimize electrode impedance and post-pulse polarization.
Claims
exact text as granted — not AI-modified1 . A method for fabricating an implantable electrode, comprising:
roughening a surface of the electrode; cleaning the roughened electrode surface; and depositing a valve metal oxide coating over the roughened electrode surface.
2 . The method of claim 1 wherein roughening the surface of the electrode comprises mechanical roughening of the electrode surface.
3 . The method of claim 2 wherein the mechanical roughening of the electrode surface comprises grit blasting.
4 . The method of claim 3 wherein the grit blasting is performed using an alumina oxide media.
5 . The method of claim 1 wherein the cleaning of the roughened electrode surface comprises ultrasonic cleaning.
6 . The method of claim 1 wherein the valve metal oxide includes ruthenium oxide.
7 . The method of claim 1 wherein depositing the valve metal comprises sputtering the valve metal onto the cleaned and roughened electrode surface using sputtering process parameters optimized to minimize post-pulse polarization
8 . The method of claim 7 wherein the sputtering process parameters, optimized to minimize post-pulse polarization, include a target power.
9 . The method of claim 7 wherein the target power is about 300 Watts.
10 . The method of claim 7 wherein the sputtering parameters optimized to minimize post-pulse polarization include a sputtering pressure.
11 . The method of claim 7 wherein the sputtering parameters optimized to minimize post-pulse polarization include a sputtering gas ratio.
12 . The method of claim 1 further comprising applying an adhesion layer to the roughened and cleaned electrode surface prior to depositing the valve metal oxide layer.
13 . The method of claim 11 wherein the adhesion layer comprises a metal selected from the group of titanium and zirconium.
14 . The method of claim 1 further comprising ion-etching the roughened electrode surface prior to depositing the valve metal oxide layer.
15 - 20 . (canceled)
21 . The method of claim 1 , wherein the valve metal oxide coating comprises a metal oxide that comprises a metal selected from the group consisting of titanium, vanadium, zirconium, niobium, molybdenum, tantalum, iridium, platinum, and tungsten.
22 . A method for fabricating an implantable medical electrode, the method comprising:
mechanically roughening a surface of the substrate; and applying a coating of a valve metal oxide over the roughened surface using sputtering in a sputtering atmosphere comprising oxygen and argon.
23 . The method of claim 22 , wherein the valve metal oxide coating comprises a metal oxide that comprises a metal selected from the group consisting of ruthenium, titanium, vanadium, zirconium, niobium, molybdenum, tantalum, iridium, platinum, and tungsten.
24 . The method of claim 22 wherein the mechanical roughening of the electrode surface comprises grit blasting.
25 . The method of claim 22 further comprising applying an adhesion layer to the roughened substrate surface prior to applying the valve metal oxide layer.
26 . The method of claim 22 further comprising ion-etching the roughened electrode surface prior to applying the valve metal oxide layer.Join the waitlist — get patent alerts
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