Thermal module

Abstract

A thermal module includes a blower, a fin unit and a heat pipe. The blower includes a base, a cover, a sidewall between the base and the cover, and an impeller arranged among the base, the cover and the sidewall. An air outlet is defined in the sidewall of the blower. The fin unit is arranged at the air outlet. The heat pipe has a contacting plate integrally formed with one of the base and the cover of the blower. The contacting plate of the heat pipe includes a dissipating surface attaching to the fin unit, and an absorbing surface with different portions adapted for contacting with electronic components, wherein the different portions of the absorbing plate being at different levels.

1 . A thermal module, comprising:
 a blower comprising a base, a cover, a sidewall between the base and the cover, and an impeller arranged among the base, the cover and the sidewall, an air outlet being defined in the sidewall of the blower;   a fin unit arranged at the air outlet of the blower; and   a heat pipe having a contacting plate integrally formed with one of the base and the cover of the blower, the contacting plate of the heat pipe comprising a dissipating surface attaching to the fin unit, and an absorbing surface having different portions adapted for contacting with electronic components, the different portions of the absorbing surface being at different levels.   
   
   
       2 . The thermal module of  claim 1 , wherein the impeller is connected to the base, and the cover is over the base, the contacting plate being integrally formed with the cover. 
   
   
       3 . The thermal module of  claim 1 , wherein the impeller is connected on the base, and the base is over the cover, the contacting plate being integrally formed with the base. 
   
   
       4 . The thermal module of  claim 1 , wherein the heat pipe further comprises a top plate arranged on and connected to the contacting plate through soldering, and a sealed space is defined between the top plate and the contacting plate. 
   
   
       5 . The thermal module of  claim 4 , wherein a plurality of posts extend from the contacting plate into the top plate, a through hole being defined in each post for a fixing member extending therethrough to assemble the thermal module to the electronic components. 
   
   
       6 . The thermal module of  claim 4 , wherein at least one protrusion extends from the contacting plate towards the top plate, at least one of the portions of the absorbing surface of the contacting plate being located at the at least one protrusion and being higher than other portions of the absorbing surface. 
   
   
       7 . The thermal module of  claim 4 , wherein at least one concave is depressed from the contacting plate, at least one of the portions of the absorbing surface of the contacting plate being located at the at least one concave and being lower than other portions of the absorbing surface. 
   
   
       8 . The thermal module of  claim 1 , wherein the heat pipe is substantially Z-shaped, and comprises a linear-shaped condensation section and an L-shaped evaporation section, the dissipating surface of the contacting plate being formed at the condensation section, the absorbing surface of the contacting plate being formed at the evaporation section. 
   
   
       9 . The thermal module of  claim 8 , wherein the evaporation section comprises an elongated portion connected to the condensation section and an end portion spaced from the condensation section, a plurality of concaves being depressed from the contacting plate corresponding to both of the elongated portion and the end portion, corresponding ones of the portions of the absorbing surface at the plurality of concaves being lower than at least one of other portions of the absorbing surface. 
   
   
       10 . The thermal module of  claim 9 , wherein at least one protrusion extends upwardly from the contacting plate at a position corresponding to the elongated portion, a corresponding one of the portions the absorbing surface at the at least one protrusion being higher than at least one of other portions of the absorbing surface. 
   
   
       11 . A thermal module, comprising:
 a blower comprising a base, a cover parallel to the base, a sidewall interconnecting outer peripheries of the base and the cover, and an impeller arranged among the base, the cover and the sidewall, the sidewall defining an air outlet therein, the impeller being rotatably connected to the base;   a fin unit arranged at the air outlet of the blower; and   a heat pipe comprising a first plate and a second plate connected together, the second plate attaching to the fin unit and integrally formed with one of the base and the cover of the blower.   
   
   
       12 . The thermal module of  claim 11 , wherein the base is over the cover, and the second plate is integrally formed with the base. 
   
   
       13 . The thermal module of  claim 11 , wherein the cover is over the base, and the second plate is integrally formed with the cover. 
   
   
       14 . The thermal module of  claim 11 , wherein at least one concave is defined in the second plate, and at least one protrusion extends upwardly from the second plate towards the first plate, a bottom side of the second plate at the at least one concave being lower than other part of the bottom side of the second plate and the bottom side of the second plate at the at least one protrusion being higher than other part of the bottom side of the second plate, whereby the bottom side of the second plate can contact with electronic components with different heights. 
   
   
       15 . The thermal module of  claim 11 , where a plurality of posts extend from the second plate into the first plate, a through hole being defined in each post for a fixing member extending therethrough.