Miniature circuitry and inductive components and methods for manufacturing same

Abstract

Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Electrical connection between the plural levels of circuitry and multiple windings around magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

1 . A method for making plural plated through holes in a single circuit board via comprising
 plating copper in the walls of said circuit board via to form a first plated through hole,   applying a thin layer of first adhesive promotor to the surface of said plated via,   vacuum deposit an organic layer having a high dielectric strength unto said layer of first adhesive promoter,   applying a second layer of adhesive promoter over said layer of polymer, and   plating copper over said second layer of adhesive promoter to form a second plated through hole in said circuit board via.   
   
   
       2 . The method of  claim 1  wherein said first adhesive promoter is applied by a PECVD process (Plasma Enhanced Chemical Vapor Deposition). 
   
   
       3 . The method of  claim 1  wherein said first adhesive promoter is Silane, Carboxyl or Silane and Carboxyl. 
   
   
       4 . The method of  claim 1  wherein said first adhesive promoter is applied by dipping the through holes in the adhesive promoter. 
   
   
       5 . The method of  claim 1  wherein said second adhesive promoter is applied by a PECVD process. 
   
   
       6 . The method of  claim 5  wherein said second adhesive promoter is a Carboxl or Silane gas phase chemical reaction. 
   
   
       7 . The method of  claim 1  wherein said organic layer is a vacuum deposited. 
   
   
       8 . The method of  claim 7  wherein said organic layer is a parylene coating. 
   
   
       9 . A method for making plural insulated conductor through holes in a single circuit board via comprising:
 applying a first conductive layer on the walls of said circuit board via to form a first conductor through hole,   applying a layer of first adhesive promoter to the surface said first conductor layer,   depositing a thin organic layer having a high dielectric strength onto said layer of first adhesive promoter.   applying a second layer of adhesive promoter on said organic layer, and   applying a second conductor layer over said second layer of adhesive promoter.