Dross Removal

Abstract

This invention relates to for devices, systems, and methods for separating dross, carried by molten solder, into solder and residue.

1 . A dross separation system comprising:
 a vessel configured to receive and contain molten solder; and   a gas injection circuit arranged to inject a gas into molten solder disposed within the vessel.   
   
   
       2 . The dross separation system of  claim 1 , wherein the gas injection circuit is configured to inject the gas into the vessel in a region below a surface level of molten solder disposed within the vessel. 
   
   
       3 . The dross separation system of  claim 1 , wherein the gas injection circuit comprises a gas injection pipe at least partially disposed within the vessel, and wherein the gas injection pipe is configured to deliver the gas into the vessel. 
   
   
       4 . The dross separation system of  claim 3 , wherein the gas injection circuit further comprises a gas source in fluid communication with the gas injection pipe, wherein the gas injection pipe is configured to deliver gas from the gas source into the vessel. 
   
   
       5 . The dross separation system of  claim 3 , wherein the gas injection pipe is at least partially disposed within the vessel in a position below a surface level of molten solder disposed within the vessel. 
   
   
       6 . The dross separation system of  claim 1 , wherein the gas injection circuit comprises:
 a gas source; and   a gas injection pipe at least partially disposed within the vessel, the gas injection pipe comprising:
 a first opening in fluid communication with the gas source; and 
 one or more apertures disposed within the vessel and in fluid communication with the first opening, wherein the gas injection pipe is operable to convey a pressurized gas from the gas source to the separating vessel. 
   
   
   
       7 . The dross separation system of  claim 1 , further comprising at least one knife extending at least partially into the vessel and arranged to contact a flow of molten solder disposed within the vessel, wherein the at least one knife is mounted for movement relative to the vessel thereby to cut through dross carried by molten solder within the vessel. 
   
   
       8 . The dross separation system of  claim 7 , wherein the gas injection circuit comprises
 a plurality of gas injection pipes disposed within the separating vessel and dispersed around the at least one knife, wherein the plurality of gas injection pipes are configured to deliver gas into molten solder within the separating chamber.   
   
   
       9 . The dross separation system of  claim 8 , wherein the gas injection pipes are substantially parallel to a motion axis of the at least one knife. 
   
   
       10 . A wave soldering system comprising:
 a separating vessel configured to receive and support molten solder;   a gas injection circuit arranged to inject a gas into molten solder disposed within the separating vessel;   a soldering vessel;   an inlet configured to deliver a flow of molten solder from the soldering vessel to the separating vessel for removal of dross from the molten solder; and   an outlet configured to deliver a flow of molten solder from the separating vessel to the soldering vessel.   
   
   
       11 . The wave soldering system of  claim 10 , wherein the gas injection circuit comprises:
 a gas source; and   one or more gas injection pipes in fluid communication with the gas source and at least partially disposed within the separating vessel, wherein the one or more gas injection pipes are arranged to deliver a gas from the gas source into the separating vessel.   
   
   
       12 . The wave soldering system of  claim 11 , wherein the one or more gas injection pipes are at least partially disposed within the separating vessel in a position below a surface level of molten solder disposed within the separating vessel. 
   
   
       13 . A method of separating dross floating on solder into solder and residue, the method comprising:
 delivering molten solder including dross into a first vessel; and   injecting a gas into the molten solder in the vessel to separate residue from the molten solder.   
   
   
       14 . The method of  claim 13 , wherein injecting the gas into the molten solder comprises delivering a gas from a gas source to a gas injection pipe at least partially disposed within the first vessel. 
   
   
       15 . The method of  claim 13 , wherein injecting the gas into the molten solder comprises delivering gas into the first vessel in a region below a surface level of the molten solder. 
   
   
       16 . The method of  claim 13 , wherein injecting the gas into the molten solder comprises delivering nitrogen gas from a gas source into the first vessel. 
   
   
       17 . The method of  claim 13 , further comprising cutting through dross carried by the molten solder. 
   
   
       18 . The method of  claim 13 , further comprising delivering the molten solder with the residue removed therefrom from the first vessel to a second vessel. 
   
   
       19 . The method of  claim 18 , wherein delivering molten solder into the separating vessel includes delivering molten solder including dross from the first vessel into the second vessel.