US2010151215A1PendingUtilityA1
Method of making an embossed card and an embossed card made therefrom
Est. expiryDec 15, 2028(~2.4 yrs left)· nominal 20-yr term from priority
Inventors:Kuo-Ching Liu
B42D 15/045B32B 5/022B32B 2307/4023B32B 3/28B32B 27/40B44C 3/025B32B 5/18B32B 2250/05B32B 2307/412B32B 5/245B32B 27/302Y10T428/24851B32B 27/306B32B 2266/0235B32B 7/12B32B 2266/0278B32B 27/32B32B 2266/0228B32B 2307/518B32B 5/24B32B 2266/0264
61
PatentIndex Score
0
Cited by
0
References
0
Claims
Abstract
A method of making an embossed card includes: (a) providing a stack which includes a substrate, a first polymeric layer formed on the substrate, a foam layer formed on the first polymeric layer, a non-woven fabric layer formed on the foam layer, and a second polymeric layer formed on the non-woven layer; (b) providing a printed pattern on the second polymeric layer; (c) providing a transparent film on the printed pattern so as to form a multilayer structure; and (d) embossing the multilayer structure so as to obtain the embossed card.
Claims
exact text as granted — not AI-modified1 . A method of making an embossed card comprising:
(a) providing a stack which includes a substrate, a first polymeric layer formed on the substrate, a foam layer formed on the first polymeric layer, a non-woven fabric layer formed on the foam layer, and a second polymeric layer formed on the non-woven fabric layer; (b) providing a printed pattern on the second polymeric layer; (c) providing a transparent film on the printed pattern so as to form a multilayer structure; and (d) embossing the multilayer structure so as to obtain the embossed card.
2 . The method of claim 1 , wherein the substrate is made of polystyrene.
3 . The method of claim 1 , wherein each of the first and second polymeric layers includes ethylene vinyl acetate copolymer.
4 . The method of claim 1 , wherein the foam layer is made of a material selected from the group consisting of ethylene vinyl acetate copolymer, polyvinyl chloride, polyethylene terephthalate, thermoplastic polyurethane, and combinations thereof.
5 . The method of claim 1 , wherein the printed pattern is formed from ink.
6 . The method of claim 1 , wherein the transparent film is made of biaxially oriented polypropylene.
7 . The method of claim 1 , further comprising the step of electroplating to attach an electroplated film to the second polymeric layer prior to step (b), wherein the printed pattern is provided on the electroplated film.
8 . The method of claim 1 , further comprising attaching a sticker to the substrate opposite to the first polymeric layer.
9 . The method of claim 1 , further comprising attaching a magnetic sheet to the substrate opposite to the first polymeric layer.
10 . The method of claim 1 , wherein the embossing in step (d) is conducted by using a high frequency embossing machine.
11 . An embossed card comprising:
an embossed multilayer structure including
a substrate;
a first polymeric layer formed on said substrate;
a foam layer formed on said first polymeric layer;
a non-woven fabric layer formed on said foam layer;
a second polymeric layer formed on said non-woven fabric layer;
a printed pattern disposed on said second polymeric layer; and
a transparent film covering said printed pattern.
12 . The embossed card of claim 11 , wherein said substrate is made of polystyrene.
13 . The embossed card of claim 11 , wherein each of said first and second polymeric layers includes ethylene vinyl acetate copolymer.
14 . The embossed card of claim 11 , wherein said foam layer is made of material selected from the group consisting of ethylene vinyl acetate copolymer, polyvinyl chloride, polyethylene terephthalate, thermoplastic polyurethane, and combinations thereof.
15 . The embossed card of claim 11 , wherein said transparent film is made of biaxially oriented polypropylene.
16 . The embossed card of claim 11 , further comprising an electroplated film sandwiched between said second polymeric layer and said transparent layer, and having the printed pattern.
17 . The embossed card of claim 11 , further comprising a sticker attached to said substrate opposite to said first polymeric layer.
18 . The embossed card of claim 11 , further comprising a magnetic sheet attached to said substrate opposite to said first polymeric layer.
19 . The embossed card of claim 11 , wherein said foam layer has a thickness of 2 mm.
20 . The embossed card of claim 11 , wherein said first polymeric layer has a thickness of 0.4 mm, and said second polymeric layer has a thickness of 0.1 mm.Join the waitlist — get patent alerts
Track US2010151215A1 — get alerts on status changes and closely related new filings.
We store only your email — no account needed. See our privacy policy.