Thermal management system using micro heat pipe for thermal management of electronic components

Abstract

A thermal management system includes a base element and a heat producing element disposed for heat transfer from the heat producing element to the base element. An adherent zone includes an adherent element in physical attachment between the heat producing element and the base element. A heat transfer zone, separate from the adherent zone, includes a heat pipe between the heat producing element and the base element. The heat pipe includes a circulatory flow path between an evaporator section and a condenser section, and a working fluid on the circulatory flow path.

1 . A thermal management system comprising:
 a base element and a heat producing element disposed for heat transfer from the heat producing element to the base element;   an adherent zone comprising an adherent element in physical attachment between the heat producing element and the base element; and   a heat transfer zone, separate from the adherent zone, comprising a heat pipe in thermal communication between the heat producing element and the base element, the heat pipe comprising a circulatory flow path comprising an evaporator section in thermal communication with the heat producing element and a condenser section in thermal communication with the base element, and a working fluid on the circulatory flow path.   
     
     
         2 . The system of  claim 1 , wherein the circulatory flow path of the heat pipe comprises a central space and a capillary medium surrounding the central space. 
     
     
         3 . The system of  claim 2 , wherein the capillary medium is comprised of carbon nanotubes, carbon nanofibers, metal mesh, gauze, felt, a sintered material, or a foam. 
     
     
         4 . The system of  claim 1 , wherein the adherent element comprises an annular seal element surrounding the heat pipe between confronting surfaces of the heat producing element and the base element. 
     
     
         5 . The system of  claim 4 , wherein the seal element comprises an epoxy material. 
     
     
         6 . The system of  claim 1 , wherein the adherent element comprises an adhesive material between confronting surfaces of the heat producing element and the base element. 
     
     
         7 . The system of  claim 1 , wherein the adherent element comprises a mechanical attachment between the heat producing element and the base element. 
     
     
         8 . The system of  claim 1 , wherein the heat pipe comprises a well formed in the base element, a capillary medium disposed adjacent at least a portion of an internal wall of the well. 
     
     
         9 . The system of  claim 1 , wherein the heat producing element comprises at least a portion of the evaporator section of the heat pipe. 
     
     
         10 . The system of  claim 1 , wherein the base element comprises at least a portion of the condenser section of the heat pipe. 
     
     
         11 . The system of  claim 1 , further comprising a vent tube between the heat pipe and ambient, the vent tube sealed from ambient during manufacture. 
     
     
         12 . The system of  claim 1 , further comprising a containment barrier around the heat pipe. 
     
     
         13 . The system of  claim 1 , wherein the heat producing element comprises an integrated circuit, a chip, a die, a heat slug, or a heat spreader. 
     
     
         14 . The system of  claim 1 , wherein the base element comprises a heat slug, a heat spreader, or a heat sink. 
     
     
         15 . A method for manufacturing a thermal management system, comprising:
 providing a heat producing element and a base element;   forming a well in the base element;   forming a vent passage in a surface of the base element extending outwardly from an edge of the well;   disposing a capillary medium within the well and surrounding a central space within the well;   placing an adherent element surrounding the well on the surface of the base element and crossing the vent passage;   assembling the heat producing element and the base element with the adherent element between confronting surfaces thereof to form an assembly with a working fluid disposed in the well;   boiling off a portion of the working fluid; and   flowing the adherent element into the vent passage and around the edge of the well to seal off the well and attach the base element and the heat producing element.   
     
     
         16 . The method of  claim 15 , wherein the step of boiling off a portion of the working fluid comprises applying a vacuum to the assembly through the vent passage. 
     
     
         17 . The method of  claim 15 , wherein the step of boiling off a portion of the working fluid comprising heating the assembly. 
     
     
         18 . The method of  claim 15 , wherein in the step of placing the adherent element, the adherent element comprises a solid ring-shaped perform comprised of an epoxy material.