Heat pipe and cooling device used in cryotechnology

Abstract

The invention relates to a heat pipe or cold pipe for cryotechnology, with a casing pipe and with a chamber encapsulated hermetically by a condensation element at one pipe end and by an evaporation element at the other pipe end and filled with a heat transfer medium suitable for cryogenics. So that superconductive elements or components can be cooled to the required transition temperature with high operating reliability and efficiency in a short cooling time, in the chamber, between the condensation element and the evaporation element, at least one cooling module is installed which partially bears with a tubular surface area against the inner surface of the casing pipe and which is provided at least on the condensation element side with a conducting means in order to guide condensed and/or liquid heat transfer medium to the surface area. The invention also relates to a cooling device having a plurality of cold pipes.

1 . A heat pipe for cryotechnology, the heat pipe comprising: a casing pipe and a chamber encapsulated hermetically by a condensation element at one pipe end and by an evaporation element at the other pipe end and filled with heat transfer medium, wherein in the chamber, between the condensation element and the evaporation element, at least one cooling module is installed which partially bears with a tubular surface area against the inner surface of the casing pipe and which is provided at least on the condensation element side with a conducting means in order to guide at least one of condensed and liquid heat transfer medium to the inside of the surface area of the cooling module. 
   
   
       2 . The heat pipe as claimed in  claim 1 , wherein the conducting means is provided with passage slots which open out to the inside of the surface area, and/or that and the conducting means is designed generally funnel-shaped. 
   
   
       3 . The heat pipe as claimed in  claim 1 , wherein the cooling module is provided on the evaporation element side with a conducting element in order to lead condensed and/or liquid heat transfer medium away from the surface area, the conducting element being generally funnel-shaped. 
   
   
       4 . The heat pipe as claimed in  claim 3 , wherein the conducting element is one of designed as a sieve or formed from a perforated plate. 
   
   
       5 . The heat pipe as claimed in  claim 3 , wherein the conducting element is provided with run-off slots running radially. 
   
   
       6 . The heat pipe as claimed in  claim 3 , wherein the cooling module, together with the conducting means, surface area and conducting element, consists of sheet metal. 
   
   
       7 . The heat pipe as claimed in  claim 1 , wherein the cooling module is inserted into the casing pipe by a shrinkage process by at least one of the cooling of the cooling module and the heating of the casing pipe. 
   
   
       8 . The heat pipe as claimed in  claim 1 , wherein the heat transfer medium is a mixture of at least two refrigerants having different condensation temperatures. 
   
   
       9 . The heat pipe as claimed in  claim 1 , wherein that side of the condensation element which faces the chamber has one of a prism-like surface with drop-off tips or a prism-like overstructure with drop-off tips, the drop-off tips lying in alignment with passage slots in the cooling module. 
   
   
       10 . The heat pipe as claimed in  claim 1 , wherein a shaft leads from the evaporation element to the condensation element and is laid concentrically to the mid-axis and is formed by a hollow pipe. 
   
   
       11 . The heat pipe as claimed in  claim 1 , wherein a plurality of cooling modules are installed in the chamber. 
   
   
       12 . The heat pipe as claimed in  claim 11 , wherein the cooling modules have centrally a leadthrough for a shaft or a hollow pipe, the hollow pipe being provided for each cooling module with at least one radial orifice, above which the conducting means bears against the hollow pipe. 
   
   
       13 . The heat pipe as claimed in  claim 1 , wherein a superconductive structural element, is positioned on the outer circumference of the casing pipe in the same installation position as the surface area of the cooling module. 
   
   
       14 . The heat pipe as claimed in  claim 1 , wherein the casing pipe is generally ring-shaped design and has an inner ring jacket and an outer ring jacket, the cooling module bearing with its surface area against one of the inner surface of the inner ring jacket or against the inner surface of the outer ring jacket. 
   
   
       15 . The heat pipe as claimed in  claim 14 , wherein a superconductive structural element to be cooled is positioned on the inner ring jacket against the inner surface of the inner ring jacket of which the surface areas of the cooling module comes to bear. 
   
   
       16 . The heat pipe as claimed in  claim 14 , wherein a ring-shaped shaft is formed between the cooling module and the outer ring jacket, against the inner surface of the outer ring jacket of which the surface areas of the cooling module does not come to bear. 
   
   
       17 . The heat pipe as claimed in  claim 14 , wherein a thermal insulation for achieving a hot bore is installed in the center of a component to be cooled, and a heat distribution element is arranged between the component to be cooled and the inner ring jacket. 
   
   
       18 . A cooling device for cryotechnology for the cooling of superconductor components or superconductor coils with at least one heat pipe, the cooling device comprising: a reception pipe, in the inner space of which the reception pipe are arranged a plurality of heat pipes, condensation elements of the heat pipes are coupled thermally to a cryocooler and casing pipes of the cryocooler are at least partially in contact with the reception pipe, cooling modules of a plurality of the heat pipes lying in one common plane, and a superconductive component being positioned in the same plane on the outer circumference of the reception pipe. 
   
   
       19 . The cooling device as claimed in  claim 18 , wherein internal thermal conducting elements are formed in the inner space of the reception pipe at the same installation height as the cooling modules, and an external thermal conductor is formed between the superconductive component and the outer circumference of the reception pipe. 
   
   
       20 . The cooling device as claimed in  claim 18 , wherein the heat pipes are anchored with their evaporation elements in a common reception base which thermally conductive and which is coupled thermally to a heating device.