Processed substrate and method for manufacturing same

Abstract

The present invention provides (i) a processed substrate having a through-hole whose openings on respective surfaces of the processed substrate are matched to each other in size, and (ii) a method for easily manufacturing the processed substrate with high efficiency. A processed substrate 1 of the present invention is a processed substrate 1 including a light transmissive substrate having a plurality of through-holes, each of which plurality of the through-holes has a larger opening diameter and a smaller opening, wherein the larger opening diameter is larger in size than the smaller opening diameter by a difference of 5% or less of a size of the larger diameter. As such, a through-hole 6 whose opening on the respective surfaces are matched to each other in size can be provided.

1 . A processed substrate comprising:
 a light transmissive substrate having a plurality of through-holes each having a larger opening diameter and a smaller opening diameter, wherein the larger opening diameter is greater in size than the smaller opening diameter by a difference of 5% or less of a size of the larger opening diameter.   
   
   
       2 . The processed substrate as set forth in  claim 1 , wherein the light transmissive substrate is made from glass. 
   
   
       3 . The processed substrate as set forth in  claim 1 , wherein the light transmissive substrate serves as a support plate for supporting a wafer. 
   
   
       4 . A method for manufacturing a processed substrate including a light transmissive substrate having a plurality of through-holes, the method comprising:
 (i) forming a pattern in each of photosensitive resin layers on respective surfaces of the light transmissive substrate by exposing the each of photosensitive resin layers to light, which pattern corresponds to a pattern of the plurality of through-holes; and   (ii) forming the plurality of through-holes, based on the pattern formed in the each of photosensitive resin layers by the step (i),   the step (i) including exposing the each of photosensitive resin layers on respective surfaces of the light transmissive substrate to light, by irradiating one of the respective surfaces of the light transmissive substrate with the light which then passes through to the other one of respective surfaces of the light transmissive substrate,   wherein that of photosensitive resin layers which is formed on the one of the respective surfaces of the light transmissive substrate has a thickness of 20 μm or thicker but not thicker than 200 μm, and the other of photosensitive resin layers which is formed on the other one of the respective surfaces of the light transmissive substrate has a thickness of 40% or greater but not greater than 70% of the thickness of that of photosensitive resin layers which is formed on the one of the respective surfaces of the light transmissive substrate.   
   
   
       5 . A method for manufacturing a processed substrate including a light transmissive substrate having a plurality of through-holes, the method comprising:
 (i) forming a pattern in each of photosensitive resin layers formed on respective surfaces of the light transmissive substrate, by exposing the each of photosensitive resin layers to light, which pattern corresponds to a pattern of the plurality of through-holes; and   (ii) forming the plurality of through-holes, based on the pattern formed in the each of photosensitive resin layers by the step   wherein the step (i) includes: irradiating one of the respective surfaces of the light transmissive substrate with light which then passes through to the other one of the respective surfaces of the light transmissive substrate; and reflecting, back to the other one of the respective surfaces of the light transmissive substrate, the light which has now passed through the other one of the respective surfaces of the light transmissive substrate, so that the other one of the respective surfaces of the light transmissive substrate is irradiated with the light thus reflected.   
   
   
       6 . The method as set forth in  claim 5 , wherein:
 that of photosensitive resin layers which is formed on the one of the respective surfaces of the light transmissive substrate has a thickness of 20 μm or thicker but not thicker than 200 μm, and the other of photosensitive resin layers which is formed on the other one of the respective surfaces of the light transmissive substrate has a thickness of 40% or greater but not greater than 70% of the thickness of that of photosensitive resin layers which is formed on the one of the respective surfaces of the light transmissive substrate.   
   
   
       7 . The method as set forth in  claim 4 , wherein:
 the step (ii) includes conically boring the light transmissive substrate from each of the respective surfaces of the light transmissive substrate to a point where conically bored holes are in communication with each other in the light transmissive substrate.   
   
   
       8 . The method as set forth in  claim 4 , wherein:
 the light transmissive substrate is made from glass; and the method further comprises, after the step (ii),   (iii) immersing, in an acid, the light transmissive substrate on which the photosensitive resin layers formed on the respective surfaces of the light transmissive substrate are left.   
   
   
       9 . The method as set forth in  claim 8 , the method further comprising, after the step (iii),
 (iv) removing the photosensitive resin layers being left on the light transmissive substrate.   
   
   
       10 . The method as set forth in  claim 5 , wherein the step (ii) includes conically boring the light transmissive substrate from each of the respective surfaces of the light transmissive substrate into a point where conically shaped holes are in communication with each other in the light transmissive substrate. 
   
   
       11 . The method as set forth in  claim 5 , the method further comprising, after the step (ii), wherein:
 the light transmissive substrate is made by glass; and   the method further comprises, after the step (ii),   (iii) immersing, in an acid, the light transmissive substrate on which the photosensitive resin layers formed on the respective surfaces of the light transmissive substrate are left.   
   
   
       12 . The method as set forth in  claim 11 , the method further comprising, after the step (iii),
 (iv) removing the photosensitive resin layers being left on the light transmissive substrate.