US2010159273A1PendingUtilityA1

Method and Apparatus for Forming a Layered Metal Structure with an Anodized Surface

Assignee: FILSON JOHN BENJAMINPriority: Dec 24, 2008Filed: Jan 23, 2009Published: Jun 24, 2010
Est. expiryDec 24, 2028(~2.4 yrs left)· nominal 20-yr term from priority
C25D 11/022C25D 5/022Y10T428/12757Y10T29/302B32B 15/013C25D 11/04B32B 15/012C25D 7/04Y10T29/49888C25D 11/26
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Claims

Abstract

Methods and apparatus for forming a multi-layered metal structure that includes an anodized surface are disclosed. According to one aspect, a housing arrangement can include a stainless steel layer and at least a first layer. The first layer can have a first bonding surface and a first exterior surface. The first bonding surface can be substantially bonded in direct contact with the stainless steel layer, and the first exterior surface can be an exterior of the housing arrangement. The first exterior surface is an anodized surface. In one embodiment, the first layer can be formed from an anodizable material such as aluminum, titanium, niobium, or tantalum.

Claims

exact text as granted — not AI-modified
1 . A housing arrangement comprising:
 a stainless steel layer; and   at least a first layer, the first layer having a first bonding surface and a first exterior surface, the first bonding surface being bonded in direct contact with the stainless steel layer, the first exterior surface being an exterior of the housing arrangement, wherein the first exterior surface is anodized.   
   
   
       2 . The housing arrangement of  claim 1  wherein the first layer is formed from one selected from the group including aluminum, titanium, niobium, and tantalum. 
   
   
       3 . The housing arrangement of  claim 1  wherein the first bonding surface is clad to the stainless steel layer. 
   
   
       4 . The housing arrangement of  claim 1  wherein the first layer is a first aluminum layer, and the first exterior surface is a first anodized aluminum surface. 
   
   
       5 . The housing arrangement of  claim 4  wherein the first anodized aluminum surface has a thickness of between approximately 8 microns and approximately 50 microns. 
   
   
       6 . The housing arrangement of  claim 4  further including:
 a second aluminum layer, the second aluminum layer having a second bonding surface and an attachment surface, the second bonding surface being bonded in direct contact with the stainless steel layer such that the stainless steel layer is sandwiched between the first aluminum layer and the second aluminum layer, the attachment surface being arranged to allow structures to be attached thereon.   
   
   
       7 . The housing arrangement of  claim 6  wherein the structures are plastic structures and the attachment surface provides a bonding surface for the plastic structures. 
   
   
       8 . The housing arrangement of  claim 6  wherein the attachment surface is at least partially anodized. 
   
   
       9 . The housing arrangement of  claim 8  wherein the attachment surface includes aluminum and anodized aluminum. 
   
   
       10 . The housing arrangement of  claim 1  wherein the stainless steel layer has a first thickness and the at least first layer has a thickness that is less than or approximately equal to one half of the first thickness. 
   
   
       11 . A method for forming a housing arrangement comprising:
 directly bonding at least a first laminant layer to a stainless steel layer;   masking at least one surface of the stainless steel layer that is not directly bonded to the at least first laminant layer, wherein masking the at least one surface of the stainless steel layer includes applying a mask to the at least one surface of the stainless steel layer;   anodizing the at least first laminant layer, wherein the at least one surface of the stainless steel that is masked is not anodized, wherein anodizing the at least first laminant layer causes a surface of the at least first laminant layer to be anodized; and   subsequently removing the mask from the at least one surface of the stainless steel layer.   
   
   
       12 . The method of  claim 11  wherein directly bonding the at least first laminant layer to the stainless steel layer includes cladding the at least first laminant layer to the stainless steel layer. 
   
   
       13 . The method of  claim 11  further comprising:
 removing an area that masking the at least one surface of the stainless steel layer prevented the area from being anodized.   
   
   
       14 . The method of  claim 11  further comprising:
 directly bonding a second laminant layer to the stainless steel layer, wherein the stainless steel layer is disposed between the first laminant layer and the second laminant layer.   
   
   
       15 . The method of  claim 11  wherein the at least first laminant layer is formed from at least one selected from a group including aluminum, titanium, niobium, and tantalum. 
   
   
       16 . The method of  claim 11  further comprising:
 chemically treating at least a portion of the at least first laminant layer to create an attachment surface; and   attaching at least one structure to the attachment surface.   
   
   
       17 . The method of  claim 16  wherein the at least one structure is a molded structure. 
   
   
       18 . A housing wall suitable for use in a portable electronic device, the housing wall comprising:
 a first aluminum layer, the first aluminum layer including a first cladding surface and a first outer surface;   a second aluminum layer, the second aluminum layer including a second cladding surface and a second outer surface; and   a stainless steel layer, the stainless steel layer being disposed between the first aluminum layer and the second aluminum layer, the first aluminum surface and the second aluminum layer being clad to the stainless steel layer such that the first cladding surface and the second cladding surface are in contact with the stainless steel layer, wherein the first outer surface and the second outer surface are at least partially anodized.   
   
   
       19 . The housing wall of  claim 18  wherein the second outer surface having attached thereto at least one part that is to be contained by the housing wall. 
   
   
       20 . The housing wall of  claim 18  wherein the first outer surface has a thickness of between approximately 8 microns and approximately 50 microns and the second outer surface has a thickness of between approximately 8 microns and approximately 50 microns. 
   
   
       21 . The housing wall of  claim 18  wherein the stainless steel layer has a first thickness, and wherein the first aluminum layer and the second aluminum layer have a combined thickness that is less than or approximately equal to one half of the first thickness.

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