Chip-Resistant Film

Abstract

A chip-resistant film includes a composite substrate having an ionomer layer and a polyolefin-based polymer layer, with a strength at upper yield point of 10 to 40 N/10 mm, wherein a pressure-sensitive adhesive is placed over the polyolefin-based polymer layer.

1 . A chip-resistant film comprising a composite substrate and a pressure-sensitive adhesive, the composite substrate comprising an ionomer layer and a polyolefin-based polymer layer and having a strength at upper yield point of 10 to 40 N/10 mm, and the pressure-sensitive adhesive overlying the polyolefin-based polymer layer of the substrate. 
   
   
       2 . The chip-resistant film according to  claim 1 , wherein the pressure-sensitive adhesive is an acrylic pressure-sensitive adhesive. 
   
   
       3 . The chip-resistant film according to  claim 1  or  2 , wherein the ionomer layer has a type D durometer hardness of D40/30 to D55/30. 
   
   
       4 . The chip-resistant film according to  claim 1  or  2 , wherein the composite substrate further comprises an intermediate adhesive layer between the ionomer layer and the polyolefin-based polymer layer.