Adhesive composition, film adhesive, and heat treatment method

Abstract

An adhesive composition of the present invention contains, as a main composition, a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group, and further contains a thermal polymerization inhibitor. As a result, it is possible to provide an adhesive composition that allows forming an adhesive layer that is excellently dissolved after the adhesive layer has been subjected to a high-temperature process.

1 - 8 . (canceled) 
   
   
       9 . A heat treatment method comprising the step of heating a material to be heated at a temperature in a range from 250° C. to 350° C., the material to be heated being an adhesive composition (i) whose main component is a polymer obtained by copolymerizing a monomer composition containing a monomer having a maleimide group and (ii) which further contains a thermal polymerization inhibitor. 
   
   
       10 . The heat treatment method as set forth in  claim 9 , comprising the steps of:
 (a) forming an adhesive layer from the adhesive composition on a surface of a substrate;   (b) heating the substrate at a temperature in a range of 250° C. to 350° C. after the step (a);   (c) stripping off the adhesive layer from the substrate after the step (b).