US2010204389A1PendingUtilityA1

Resin composition and cured product using it, and sheet

Assignee: DENKI KAGAKU KOGYO KKPriority: Feb 4, 2005Filed: Apr 23, 2010Published: Aug 12, 2010
Est. expiryFeb 4, 2025(expired)· nominal 20-yr term from priority
H10W 74/47H10W 40/251C08F 265/04C08F 265/06C08L 51/003C08F 222/102C08K 5/372C08J 5/18C08L 21/00C08L 33/08
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Claims

Abstract

To provide a resin composition excellent in conformability to special shapes and in holding power without the need of containing a low molecular softener such as a plasticizer, other than a polysiloxane, and a cured product and a sheet using it. A resin composition characterized by comprising (a) an acrylic rubber, (b) a compound containing at least two mercapto groups per molecule, (c) a compound containing at least two acryloyl and/or methacryloyl groups per molecule, (d) an acrylate and/or methacrylate having a C 2-12 alkyl group, and (e) acrylic acid or methacrylic acid. The above resin composition which contains a thermally conductive filler. A cured product and sheet using it.

Claims

exact text as granted — not AI-modified
1 . A resin composition, comprising:
 (a) an acrylic rubber;   (b) a compound comprising at least two mercapto groups per molecule;   (c) a compound comprising at least two acryloyl and/or methacryloyl groups per molecule;   (d) an acrylate and/or methacrylate comprising a C 2-12  alkyl group; and   (e) acrylic acid or methacrylic acid.   
   
   
       2 . The resin composition according to  claim 1 , wherein the resin composition further comprises (f) a thermally conductive filler.

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