Temperature control system for semiconductor manufacturing equipment

Abstract

A temperature control system for semiconductor manufacturing equipment is disclosed, which can properly cool a process chamber adopted in the semiconductor manufacturing equipment such as a wafer etching device. The temperature control system for semiconductor manufacturing equipment includes a thermocline for cooling heat transfer fluid accommodated therein through a heat exchange with a heat exchanger and storing heat energy, a supply line for controlling the temperature of the heat transfer fluid in the thermocline through a heater and supplying the heat transfer fluid with a proper temperature to a process device, a recovery line for forwarding the heat transfer fluid having passed through the process device to the thermocline, and a bypass for forwarding a part of the heat transfer fluid passing through the recovery line to the supply line through the heater.

1 . A temperature control system for semiconductor manufacturing equipment, comprising:
 a thermocline for cooling heat transfer fluid accommodated therein through a heat exchange with a heat exchanger and storing heat energy;   a supply line for controlling the temperature of the heat transfer fluid in the thermocline through a heater and supplying the heat transfer fluid with a proper temperature to a process device;   a recovery line for forwarding the heat transfer fluid having passed through the process device to the thermocline; and   a bypass for forwarding a part of the heat transfer fluid passing through the recovery line to the supply line through the heater.   
   
   
       2 . A temperature control system for semiconductor manufacturing equipment, comprising:
 a circulation line for supplying heat transfer fluid to a process device and then recovering the supplied heat transfer fluid;   a thermocline for cooling the heat transfer fluid accommodated therein through a heat exchange with a heat exchanger, storing heat energy, receiving a part of the heat transfer fluid circulating through the circulation line, and then supplying the part of the heat transfer fluid accommodated therein to the circulation line; and   a heater for controlling a temperature of the heat transfer fluid being supplied to the process device through the circulation line at a proper temperature level.   
   
   
       3 . The temperature control system of  claim 1 , further comprising a proportional control valve for controlling a flow of the heat transfer fluid so that a flow rate of the heat transfer fluid flowing into the thermocline through the process device and a flow rate of the heat transfer fluid being discharged to be supplied from the thermocline to the process device substantially coincide with each other. 
   
   
       4 . The temperature control system of  claim 1 , wherein the thermocline comprises a phase change material (PCM) pipe for storing thermal energy using a PCM. 
   
   
       5 . The temperature control system of  claim 1 , further comprising a plurality of process devices connected to the thermocline so that the thermocline supplies the heat transfer fluid to the respective process devices. 
   
   
       6 . The temperature control system of  claim 1 , further comprising an auxiliary bypass for supplying to the heater the part of the heat transfer fluid being supplied to the process device through the heater. 
   
   
       7 . The temperature control system of  claim 2 , further comprising a proportional control valve for controlling a flow of the heat transfer fluid so that a flow rate of the heat transfer fluid flowing into the thermocline through the process device and a flow rate of the heat transfer fluid being discharged to be supplied from the thermocline to the process device substantially coincide with each other. 
   
   
       8 . The temperature control system of  claim 2 , wherein the thermocline comprises a phase change material (PCM) pipe for storing thermal energy using a PCM. 
   
   
       9 . The temperature control system of  claim 2 , further comprising a plurality of process devices connected to the thermocline so that the thermocline supplies the heat transfer fluid to the respective process devices. 
   
   
       10 . The temperature control system of  claim 2 , further comprising an auxiliary bypass for supplying to the heater the part of the heat transfer fluid being supplied to the process device through the heater.