Microfluidic devices fabricated by direct thick film writing and methods thereof
Abstract
The present invention relates to a process for producing a microfluidic device which involves providing a substrate with a surface and writing a first flowable material on the surface of the substrate. The first flowable material is then solidified to form spacer elements, each with a top surface distal from the surface of the substrate, and a second flowable material is written on the surface of the substrate. A cover having a surface is provided and applied to the substrate, with the surface of the cover contacting the top surfaces of the spacer elements. The second flowable material is solidified to form walls, where the walls, the surface of the substrate, and the surface of the cover form flow channels of a microfluidic device. The resulting microfluidic device is also disclosed.
Claims
exact text as granted — not AI-modified1 . A microfluidic device comprising:
a substrate with a non-planar surface; a cover; one or more spacer elements on the non-planar surface and connecting the substrate and the cover; and one or more walls between the cover and non-planar surface of the substrate, wherein the walls, the non-planar surface of the substrate, and the cover form flow channels of a microfluidic device.
2 . The microfluidic device of claim 1 , wherein a conductive material is on the non-planar surface of the substrate.
3 . The microfluidic device of claim 2 , wherein the conductive material is in at least some of the flow channels of the microfluidic device.
4 . The microfluidic device of claim 1 further comprising:
one or more holes extending through the substrate from its surface and/or through the cover to supply and/or remove fluids to and/or from the flow channels.
5 . The microfluidic device of claim 1 , wherein the substrate and the cover are independently made from a material selected from the group consisting of a polymer, a metal, a ceramic, a semiconductor, and a composite thereof.
6 . The microfluidic device of claim 1 , wherein spacer elements and the walls are made from materials independently selected from the group consisting of a polymer, a metal, a glass, a ceramic, a semiconductor, and a composite thereof.Join the waitlist — get patent alerts
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