Carrier For Holding Semiconductor Wafers During A Double-Side Polishing Of The Semiconductor Wafers

Abstract

The invention relates to a carrier for holding semiconductor wafers during a double-side polishing of the semiconductor wafers, comprising cutouts for receiving the semiconductor wafers and passage openings for a polishing agent supplied during the polishing. Some of the passage openings are formed by holes which have a diameter of 2 to 8 mm and are arranged at a distance of 1 to 10 mm around the cutouts, wherein the holes are arranged on two central sections and an inner or an outer section of a circular path.

1 . A carrier for holding semiconductor wafers during double-side polishing of the semiconductor wafers, comprising cutouts for receiving the semiconductor wafers and passage openings for a polishing agent supplied during the polishing, wherein some of the passage openings are formed by holes which have a diameter of 2 to 8 mm and are arranged at a distance of 1 to 10 mm around the cutouts, wherein the holes are arranged on two central sections and on at least one of an inner or an outer section of a circular path. 
     
     
         2 . The carrier of  claim 1 , wherein the holes have an identical distance between holes of 3 to 30 mm. 
     
     
         3 . The carrier of  claim 1 , wherein the holes are arranged on the central sections and additionally on the outer section and the inner section of the circular path. 
     
     
         4 . The carrier of  claim 2 , wherein the holes are arranged on the central sections and additionally on the outer section and the inner section of the circular path. 
     
     
         5 . A method for the double-side polishing of semiconductor wafers, wherein the semiconductor wafers are held in a carrier of  claim 1 , during double-side polishing. 
     
     
         6 . A method for the double-side polishing of semiconductor wafers, wherein the semiconductor wafers are held in a carrier of  claim 2 , during double-side polishing. 
     
     
         7 . A method for the double-side polishing of semiconductor wafers, wherein the semiconductor wafers are held in a carrier of  claim 3 , during double-side polishing. 
     
     
         8 . A method for the double-side polishing of semiconductor wafers, wherein the semiconductor wafers are held in a carrier of  claim 4 , during double-side polishing.