Optically enabled integrated circuit package
Abstract
There is provided a mating clip for securing a connection between an optical connector and an optical port of a hybrid optically enabled integrated circuit package, the optical connector having an optical cable end to which is attached an optical cable and having a connector end opposite the optical cable end, the mating clip comprising: a cover for substantially covering the optical connector, the cover comprising an opening to permit passage of the optical cable; an S-shaped curved feature extending from the cover and for applying a force against the optical cable end; and a hook-shaped feature extending from the cover in the direction of the connector end of the optical connector and for securing an assembly formed by the mating clip and the optical connector to the optical port; wherein, in the securing of mating clip/optical connector assembly, the hook-shaped feature interacts with at least one of a notch internal to the hybrid optically enabled integrated circuit package; and a protrusion on the optical port.
Claims
exact text as granted — not AI-modified1 . A mating clip for securing a connection between an optical connector and an optical port of a hybrid optically enabled integrated circuit package, the optical connector having an optical cable end to which is attached an optical cable and having a connector end opposite the optical cable end, the mating clip comprising:
a. a cover for substantially covering the optical connector, the cover comprising an opening to permit passage of the optical cable; b. an S-shaped curved feature extending from the cover and for applying a force against the optical cable end; and c. a hook-shaped feature extending from the cover in the direction of the connector end of the optical connector and for securing an assembly formed by the mating clip and the optical connector to the optical port;
wherein, in the securing of the assembly formed by the mating clip and the optical connector, the hook-shaped feature interacts with at least one of a notch internal to the hybrid optically enabled integrated circuit package and a protrusion on the optical port.
2 . The mating clip of claim 1 , wherein the S-shaped curved feature and the hook-shaped feature are compatible with multiple versions of optical ports.
3 . The mating clip of claim 1 , wherein the cover allows access to other optical ports located on a perimeter of the hybrid optically enabled integrated circuit package.
4 . The mating clip of claim 1 further comprising a wing feature extending from the cover and for handling the mating clip in the securing to the optical port.
5 . The mating clip of claim 1 , further comprising a barrier positioned over the optical connector and the optical port for sealing the connection.
6 . The mating clip of claim 1 , wherein the hook-shaped feature comprises a resilient piece that deflect inwardly and then springs back into place once pushed slightly ahead of the notch.
7 . The mating clip of claim 1 , wherein the optical port comprises alignment dowel pins fixed inside to protect the hybrid optically enabled integrated circuit package.
8 . The mating clip of claim 1 , wherein the optical port protrudes from a side of the hybrid optically enabled integrated circuit package.
9 . The mating clip of claim 1 , wherein the mating clip is in contact with the optical port and contactless with the hybrid optically enabled integrated circuit package to allow maximum tolerances.
10 . A method for using a mating clip for securing a connection between an optical connector and an optical port of a hybrid optically enabled integrated circuit package, the method comprising:
a. providing a mating clip having a hook-shaped feature extending therefrom; b. inserting the optical connector within the mating clip, thereby forming a mating clip/optical connector assembly; and c. securing the mating clip/optical connector assembly to the optical port using an interaction between the hook-shaped feature and at least one of a notch internal to the hybrid optically enabled integrated circuit package and a protrusion on the optical port.
11 . The method of claim 10 , wherein the providing, inserting, and securing are done independently of a positioning of other components on a Printed Circuit Board.
12 . The method of claim 10 , wherein the providing, inserting, and securing are done during final stages of board assembly.
13 . The method of claim 10 , further comprising removal of any protective cover or rubber boot over the optical port prior to inserting the optical connector within the mating clip.
14 . The method of claim 10 , wherein the securing allows access to other optical ports located on a perimeter of the hybrid optically enabled integrated circuit package.Cited by (0)
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