System and Method for Assembly of a Processor and Socket on an Information Handling System Printed Circuit Board

Abstract

A grid array socket pin field is protected during manufacture of an information handling system with a dust cap having first and second attachment devices. The first attachment device secures the cap to the socket during assembly of the socket in the computer. The second attachment device secures the cap to a load mechanism assemble proximate the socket. Engagement of the second attachment device to the cap automatically releases the cap from the socket to allow removal of the cap from the socket by actuation of the load mechanism to an open position. The second attachment device secures the cap to the load mechanism until a processor is placed in the socket.

1 - 8 . (canceled) 
   
   
       2 . A method for assembly of components on a printed circuit board, the method comprising:
 securing a cap to a socket;   coupling the socket to the printed circuit board;   coupling a load mechanism to the circuit board proximate the socket; and   engaging a load plate of the load mechanism with the cap, the engaging releasing the cap from the socket.   
   
   
       3 . The method of claim  9  further comprising:
 lifting the load plate to lift the cap from the socket.   
   
   
       11 . The method of claim  10  further comprising:
 leaving the load plate engaged with the cap to secure the cap away from the socket; and   placing a processor in the socket.   
   
   
       12 . The method of  claim 11  further comprising:
 removing the cap from the load mechanism after the placing a processor in the socket; and   engaging the load plate over the processor to secure the processor in the socket.   
   
   
       13 . The method of claim  9  wherein securing a cap comprises engaging an arm extending from the cap to the socket. 
   
   
       14 . The method of  claim 13  wherein engaging a load plate comprise engaging an opposing end of the arm extending from the cap to the load plate, the engaging an opposing end releasing the arm from the socket. 
   
   
       15 . The method of claim  9  wherein the socket comprises a grid array. 
   
   
       16 . The method of  claim 15  wherein coupling the socket to the printed circuit board further comprises lifting the socket by attaching an arm to the cap and lifting the cap. 
   
   
       17 . A method for protecting a grid array socket having a pin field, the method comprising:
 securing a cap to the socket with a first attachment device, the cap covering the pin field;   securing a load mechanism to the cap with a second attachment device;   releasing the first attachment device to free the cap from the socket; and   actuating the load mechanism to lift the cap from the socket.   
   
   
       18 . The method of  claim 17  further comprising:
 placing a processor in the socket;   releasing the cap from the load mechanism; and   securing the processor in the socket with the load mechanism.   
   
   
       19 . The method of  claim 17  wherein releasing the first attachment device further comprises interacting the second attachment device with the first attachment device during the securing a load mechanism, the interacting causing the release of the first attachment device. 
   
   
       20 . The method of  claim 19  wherein the first and second attachment devices comprise a flexible arm having a socket attachment point at one end and a load mechanism attachment point at an opposing end.