US2010224854A1PendingUtilityA1
Light emitting device
Est. expiryMar 3, 2029(~2.6 yrs left)· nominal 20-yr term from priority
H10H 20/872H10H 20/819
55
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Abstract
A light emitting device (LED) is provided. The LED comprises a light emitting structure and a mixed-period photonic crystal structure. The light emitting structure comprises a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer. The mixed-period photonic crystal structure is on the light emitting structure.
Claims
exact text as granted — not AI-modified1 - 20 . (canceled)
21 . A light emitting device (LED), comprising:
a light emitting structure comprising a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer; and a mixed-period photonic crystal structure on the light emitting structure.
22 . The LED of claim 21 , wherein the mixed-period photonic crystal structure comprises:
a first photonic crystal structure having a first period in a partial region of the first conductivity type semiconductor layer; and a second photonic crystal structure having a second period in the partial region of the first conductivity type semiconductor layer that includes the first photonic crystal structure.
23 . The LED of claim 22 , wherein the second period is smaller than the first period.
24 . The LED of claim 23 , wherein the second period is non-uniform.
25 . The LED of claim 23 , wherein the second period is uniform.
26 . The LED of claim 23 , wherein the second period is about 100 nm to about 800 nm.
27 . The LED of claim 21 , further comprising an undoped semiconductor layer on the first conductivity type semiconductor layer.
28 . The LED of claim 27 , wherein the mixed-period photonic crystal structure comprises:
a first photonic crystal structure having a first period in a partial region of the undoped semiconductor layer; and a second photonic crystal structure having a second period in the partial region of the undoped semiconductor layer that includes the first photonic crystal structure.
29 . The LED of claim 21 , further comprising a nonconductive substrate on a side of the light emitting structure that is opposite to a side of the light emitting structure with the mixed-period photonic crystal structure.
30 . The LED of claim 29 , wherein the mixed-period photonic crystal structure is on the second conductivity type semiconductor layer.
31 . A light emitting device (LED), comprising:
a light emitting structure comprising a first conductivity type semiconductor layer, an active layer, and a second conductivity type semiconductor layer; a conductive substrate on the light emitting structure; and a mixed-period photonic crystal structure on the conductive substrate.
32 . The LED of claim 31 , wherein the mixed-period photonic crystal structure comprises:
a first photonic crystal structure having a first period in a partial region of the conductive substrate; and a second photonic crystal structure having a second period in the partial region of the conductive substrate that includes the first photonic crystal structure.
33 . The LED of claim 32 , wherein the second period is smaller than the first period.
34 . The LED of claim 32 , wherein the second period is non-uniform.
35 . The LED of claim 32 , wherein the second period is uniform.
36 . The LED of claim 33 , wherein the first period is about 400 nm to about 3,000 nm and the second period is about 100 nm to about 800 nm.
37 . The LED of claim 31 , further comprising a first electrode on a portion of the conductive substrate without the mixed-period photonic crystal structure.
38 . The LED of claim 37 , wherein the first electrode comprises at least one of an ohmic contact layer, a reflection layer, and a coupling layer.
39 . The LED of claim 31 , further comprising a second electrode layer on the second conductivity type semiconductor layer.
40 . The LED of claim 39 , wherein the second electrode layer comprises at least one of an ohmic contact layer, a reflection layer, a coupling layer, and a second substrate.
41 . The LED of claim 31 , wherein the conductive substrate comprises at least one of gallium nitride, gallium oxide, zinc oxide, silicon carbide, and a metal oxide.
42 . The LED of claim 31 , wherein the conductive substrate is polished to a thickness of about 70 μm to about 100 μm.Cited by (0)
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