Heat-dissipating device including a plating metal layer

Abstract

A heat-dissipating device includes: a planar body made of a graphite laminate and extending along an x-y plane of the graphite laminate; and a plating metal layer formed on the planar body. The heat-dissipating device further includes a metal panel. The planar body is connected substantially perpendicularly to the metal panel. A method of making the heat-dissipating device is also disclosed.

1 . A heat-dissipating device comprising:
 a planar body made of a graphite laminate and extending along an x-y plane of said graphite laminate; and   a plating metal layer formed on said planar body.   
     
     
         2 . The heat-dissipating device of  claim 1 , wherein said plating metal layer has a layer thickness not less than 1 μm. 
     
     
         3 . The heat-dissipating device of  claim 1 , wherein said plating metal layer is selected from the group consisting of copper, nickel, chromium, gold, silver, tin, platinum, and combinations thereof. 
     
     
         4 . The heat-dissipating device of  claim 1 , wherein said planar body has top and bottom surfaces, a pair of opposite first lateral sides and opposite second lateral sides, which interconnect said top and bottom surfaces, said plating metal layer being formed on said top surface and said opposite first lateral sides. 
     
     
         5 . The heat-dissipating device of  claim 4 , wherein said plating metal layer is further formed on said bottom surface. 
     
     
         6 . The heat-dissipating device of  claim 1 , wherein said plating metal layer includes a plurality of metal films. 
     
     
         7 . The heat-dissipating device of  claim 6 , wherein said metal films include a copper film formed on said planar body, and a nickel film formed on said copper film. 
     
     
         8 . The heat-dissipating device of  claim 7 , wherein said copper film has a thickness ranging from 8 μm to 10 m, and said nickel film has a thickness ranging from 2 μm to 5 μm. 
     
     
         9 . The heat-dissipating device of  claim 1 , further comprising an insulation film attached to said plating metal layer. 
     
     
         10 . The heat-dissipating device of  claim 1 , further comprising a metal panel, said planar body being substantially perpendicular to said metal panel, said plating metal layer being secured to said metal panel. 
     
     
         11 . The heat-dissipating device of  claim 10 , wherein said metal panel has an elongated groove, and said planar body has top and bottom surfaces, and a pair of opposite first lateral sides and opposite second lateral sides, said plating metal layer being formed on said top and bottom surfaces and said opposite first lateral sides, one of said first lateral sides being inserted into said elongated groove. 
     
     
         12 . A heat-dissipating device comprising:
 a metal panel having a first surface adapted to support an electronic component; and   a plurality of spaced apart planar bodies each of which is made of a graphite laminate and extends along an x-y plane of said graphite laminate, and each of which is formed with a plating metal layer thereon;   said planar bodies being substantially perpendicular to a second surface of said metal panel which is opposite to said first surface, said plating metal layers on said planar bodies being secured to said metal panel.   
     
     
         13 . The heat-dissipating device of  claim 12 , wherein each of said planar bodies has top and bottom surfaces, and a pair of opposite first lateral sides and opposite second lateral sides, said plating metal layer being formed on said top and bottom surfaces and said opposite first lateral sides. 
     
     
         14 . The heat-dissipating device of  claim 13 , wherein said second surface of said metal panel has a plurality of parallel elongated grooves, each of said elongated grooves receiving one of said first lateral sides of a respective one of said planar bodies. 
     
     
         15 . A method of making a heat-dissipating device comprising:
 (a) cleaning a planar body that is made of a graphite laminate and that extends along an x-y plane of the graphite laminate; and   (b) electroplating the planar body so that a plating metal layer is formed on the planar body.   
     
     
         16 . The method of  claim 15 , wherein, in step (a), cleaning is conducted by using an acid solution so as to remove oil contaminant and oxide on the planar body. 
     
     
         17 . The method of  claim 16 , wherein the acid solution is sulfuric acid having a concentration not less than 0.5 wt %. 
     
     
         18 . The method of  claim 15 , wherein, in step (a), cleaning is conducted by using atmospheric pressure plasma. 
     
     
         19 . The method of  claim 15 , wherein the plating metal layer includes a copper film formed on the planar body and a nickel film formed on the copper film. 
     
     
         20 . The method of  claim 19 , wherein the copper film has a thickness ranging from 8 μm to 10 μm, and the nickel film has a thickness ranging from 2 μm to 5 μm.