US2010244016A1PendingUtilityA1
Display substrate and method of manufacturing the same
Est. expiryDec 7, 2027(~1.4 yrs left)· nominal 20-yr term from priority
G02F 1/136H10K 71/135H10K 10/462H10K 71/621H10K 19/10
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Claims
Abstract
In a manufacturing method of a display substrate according to one or more embodiments, a plurality of thin films are patterned by using a photoresist film pattern having different thicknesses in each area on a substrate as etch masks. The photoresist film pattern may be etch-backed at least twice during the manufacturing process of the display substrate and may be used as the etch mask for patterns having shapes different from each other. Accordingly, the number of processes for manufacturing the mask patterns, which may be formed by a photolithography method in order to pattern the thin films formed on the substrate, may be reduced.
Claims
exact text as granted — not AI-modified1 . A display substrate comprising:
a substrate in which a pixel area is defined; a gate line formed on the substrate; a gate insulating layer formed on the substrate to cover the gate line; a data line insulated from the gate line while crossing the gate line, wherein the data line in combination with the gate line define the pixel area; a gate electrode branching from the gate line; a source electrode branching from the data line; a drain electrode spaced apart from the source electrode; an organic semiconductor layer formed on the source electrode and the drain electrode; and a pixel electrode formed on the substrate in correspondence with the pixel area, and electrically connected to the drain electrode, wherein a portion of the gate insulating layer corresponding to an area in which the organic semiconductor layer is formed has a surface energy greater than a surface energy of the gate insulating layer corresponding to an area in which the organic semiconductor layer is not formed.
2 . The display substrate of claim 1 , wherein the portion of the gate insulating layer corresponding to an area, in which the organic semiconductor layer is formed, does not comprise fluorine.
3 . The display substrate of claim 1 , wherein the substrate further comprises glass or plastic.
4 . The display substrate of claim 1 , wherein the organic semiconductor layer comprises pentacene.Cited by (0)
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