Heat-resistant adhesive sheet

Abstract

The present invention relates to a heat-resistant adhesive sheet (tape). More particularly, the invention relates to a heat-resistant adhesive sheet of high reliability and workability, in which crosslink reaction can be induced through irradiation of energy rays on an adhesive layer to achieve heat resistance at high temperature and also high dimension stability in parts, to achieve release without leaving any adhesive residues on an attached surface in releasing the layer and also to achieve no oxidation on the attached surface, e.g., a metallic surface at a high temperature. To this end, the heat-resistant adhesive sheet (tape) according to the invention is characterized by comprising a heat-resistant substrate, and an adhesive layer formed on at least one side of the heat-resistant substrate and made with a coating of liquid comprising energy ray curable olygomer resin, thermosetting adhesive resin, energy ray initiator and thermosetting agent, the adhesive layer being cured and heat resistant by irradiating energy rays to induce crosslink reaction.

1 . A heat-resistant adhesive sheet, comprising:
 a heat-resistant substrate; and   an adhesive layer formed on at least one side of the heat-resistant substrate and made with a coating of liquid, the liquid comprising:   energy ray curable olygomer resin;   thermosetting adhesive resin;   energy ray initiator; and   thermosetting agent, and   the adhesive layer being cured and heat resistant by irradiating energy rays to induce crosslink reaction.   
     
     
         2 . The sheet as claimed in  claim 1 , wherein the heat-resistant substrate is a film made of at least one selected among from the group consisting of polyester, polyimide, polyamide, polyether sulfone, polyphenylene sulfide, polyether ketone, polyether etherketone, triacetyl cellulose, polyether imide, polyethylene naphthalate, polypropylene and polycarbonate. 
     
     
         3 . The sheet as claimed in  claim 1 , wherein the heat-resistant substrate is thin metallic foil of at least one selected from the group consisting of thin foil, alloy foil and plated foil, made of aluminum, magnesium, titanium, chrome, manganese, iron, nickel, zinc, or tin. 
     
     
         4 . The sheet as claimed in  claim 1 , wherein two or more types of the energy ray curable olygomer resin are used together in the adhesive layer as required for the purpose of design, and the ratio of the energy ray curable olygomer resin to thermosetting adhesive resin in the adhesive layer is 1/9 to 1. 
     
     
         5 . The sheet as claimed in  claim 1 , wherein the weight average molecular weight of the thermosetting adhesive resin lies between about 40,000 and about 3,000,000. 
     
     
         6 . The sheet as claimed in  claim 1 , wherein one or two or more types of the energy ray initiator is/are used as required for the purpose of design, and the amount of the energy ray initiator lies between 1/100 and ⅕ as compared to the total amount of the energy ray curable olygomer resin. 
     
     
         7 . The sheet as claimed in  claim 1 , wherein the energy ray curable olygomer resin in the adhesive layer is cured with visible rays, ultraviolet rays or electron beams. 
     
     
         8 . The sheet as claimed in  claim 1 , wherein the heat-resistant adhesive sheet is deposited on the copper foil and then heat-treated for about 40 minutes at about 200° C., the resultant sheet having adhesiveness of 5 g·f/2.54 cm in width to 600 g·f/2.54 cm or less in width, after placing it at a room temperature for one hour. 
     
     
         9 . The sheet as claimed in  claim 1 , wherein the heat-resistant adhesive sheet is deposited on a piece of copper foil, glass plate or stainless steel plate and then has adhesiveness of 5 g·f/2.54 cm in width to 120 g·f/2.54 cm or less in width after placing it at a room temperature for one hour. 
     
     
         10 . The sheet as claimed in  claim 1 , wherein the weight of the adhesive in the adhesive layer in the heat-resistant adhesive sheet is reduced by 2% or less thereof in weight when it is heated by raising temperature from a room temperature to about 250° C., by about 10° C./min. 
     
     
         11 . The sheet as claimed in  claim 1 , wherein the heat-resistant adhesive sheet is deposited on a metallic surface for masking the metallic surface, in order to protect the surface by preventing oxidization at a temperature of about 250° C.