US2010248970A1PendingUtilityA1

Apparatus for and method of continuous hts tape buffer layer deposition using large scale ion beam assisted deposition

55
Assignee: SUPERPOWER INCPriority: Jun 26, 2003Filed: Jun 10, 2010Published: Sep 30, 2010
Est. expiryJun 26, 2023(expired)· nominal 20-yr term from priority
C23C 14/541C23C 14/083C23C 14/54C23C 14/562
55
PatentIndex Score
0
Cited by
0
References
0
Claims

Abstract

The present invention is a high-throughput ion beam assisted deposition (IBAD) system and method of utilizing such a system that enables continuous deposition of thin films such as the buffer layers of HTS tapes. The present invention includes a spool-to-spool feed system that translates a metal substrate tape through the IBAD system as the desired buffer layers are deposited atop the translating substrate tape using an e-beam evaporator assisted by an ion beam. The system further includes a control and monitor system to monitor and regulate all necessary system parameters. The present invention facilitates deposition of a high-quality film over a large area of translating substrate.

Claims

exact text as granted — not AI-modified
1 . A process for continuous deposition of a coating of an HTS tape, comprising:
 loading a substrate into a deposition chamber;   translating the substrate through the deposition chamber;   depositing a coating material from a deposition source on the substrate to thereby form the coating while translating the substrate, the coating being a buffer layer over which an HTS layer is formed, the buffer layer having a biaxial texture;   impinging an ion beam from an ion source on the substrate during depositing;   monitoring the biaxial texture of the coating during depositing; and   adjusting the power level of at least one of the ion source and the deposition source during depositing based on the monitoring of biaxial texture.   
   
   
       2 . The process of  claim 1 , wherein the buffer layer has an in-plane texture of not greater than 20 degrees. 
   
   
       3 . The process of  claim 2 , wherein the buffer layer has an in-plane texture of not greater than 15 degrees. 
   
   
       4 . The process of  claim 3 , wherein the buffer layer has an in-plane texture of not greater than 14 degrees. 
   
   
       5 . The process of  claim 1 , wherein the coating material is generated by vaporizing a material source in the deposition chamber, vaporization being carried out by energizing an energy source. 
   
   
       6 . The process of  claim 5 , wherein the energy source is selected from the group consisting of electron beam energy, ion beam energy, and magnetron energy. 
   
   
       7 . The process of  claim 1 , wherein the substrate is translated through the deposition chamber by a reel-to-reel system. 
   
   
       8 . The process of  claim 1 , wherein a substrate block and the substrate are in a heat transfer relationship, the substrate block being maintained at a temperature below 50° C. 
   
   
       9 . The process of  claim 1 , wherein the tape is translated through the deposition chamber at a speed within a range of about 0.4 to 300 meters/hour. 
   
   
       10 . The process of  claim 1 , wherein the coating material is selected from the group consisting of MgO and YSZ. 
   
   
       11 . The process of  claim 1 , wherein the coating material is deposited with the assist of an ion beam. 
   
   
       12 . The process of  claim 1 , wherein the substrate comprises a nickel alloy. 
   
   
       13 . A process for continuous deposition of a coating of an HTS tape, comprising:
 loading a substrate into a deposition chamber;   translating the substrate through the deposition chamber;   depositing a coating material from a deposition source on the substrate to thereby form the coating while translating the substrate, the coating being a buffer layer over which an HTS layer is formed, the buffer layer having a biaxial texture;   impinging an ion beam from an ion source on the substrate during depositing;   monitoring the biaxial texture of the coating, a number of ions from the ion beam impinging on the substrate, and a thickness of the coating during depositing; and   adjusting the power level of at least one of the ion source and the deposition source during depositing based on the monitoring of biaxial texture.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.