Composite for multilayer circuit board

Abstract

A crosslinkable and polymerizable composition containing a monomer and a cross-linking agent is applied onto a metal foil to form a coated film of the composition, and heat is applied to the coated film to firstly bulk polymerize the entire coated film of the crosslinkable and polymerizable composition. Then, by applying heat to the coated film from the metal foil side, cooling a surface far from the metal foil as needed, and subjecting a limited region adjacent to the metal foil in the thickness direction of the coated film to a cross-linking reaction, a composite for multilayer circuit board is obtained, in which the metal foil layer, a hard resin layer containing a hard resin obtained by bulk polymerization reaction and cross-linking reaction, and an adhesive resin layer containing an adhesive resin obtained by bulk polymerization reaction are laminated in this order.

1 - 14 . (canceled) 
     
     
         15 . A composite for multilayer circuit board, comprising:
 a layer of metal foil;   a hard resin layer containing a hard resin obtained by bulk polymerization reaction (1) and cross-linking reaction; and   an adhesive resin layer containing an adhesive resin obtained by bulk polymerization reaction (2),   said layer of metal foil, said hard resin layer and said adhesive resin layer being laminated in this order.   
     
     
         16 . The composite for multilayer circuit board as set forth in  claim 15 , wherein at least either one of said hard resin layer or said adhesive resin layer includes cycloolefin polymer. 
     
     
         17 . The composite for multilayer circuit board as set forth in  claim 15 , wherein said adhesive resin layer further contains a cross-linking agent (2). 
     
     
         18 . The composite for multilayer circuit board as set forth in  claim 16 , wherein said adhesive resin layer further contains a cross-linking agent (2). 
     
     
         19 . A manufacturing method of a composite for multilayer circuit board, comprising:
 forming an intermediate composite (A) by integrating a layer of metal foil and a crosslinkable resin layer containing a resin obtained by bulk polymerization reaction and a cross-linking agent (1); and   applying heat to said intermediate composite (A) from the layer of metal foil side to subject a limited region of said crosslinkable resin layer adjacent to the metal foil to cross-linking reaction thereby said crosslinkable resin layer becomes to comprise a hard resin layer containing a hard resin obtained by bulk polymerization reaction and cross-linking reaction and an adhesive resin layer containing an adhesive resin obtained by bulk polymerization reaction.   
     
     
         20 . The manufacturing method of a composite for multilayer circuit board as set forth in  claim 19 , wherein the cross-linking reaction of said intermediate composite (A) takes place under a condition where a surface of said crosslinkable resin layer far from the layer of metal foil has a temperature lower than or equal to a one-minute half-life temperature of said cross-linking agent (1). 
     
     
         21 . The manufacturing method of a composite for multilayer circuit board as set forth in  claim 19 , wherein said intermediate composite (A) is obtained by applying a crosslinkable and polymerizable composition containing a bulk polymerizable monomer and said cross-linking agent (1) on said metal foil to form a coated film of said composition and applying heat to said coated film to be bulk polymerized. 
     
     
         22 . The manufacturing method of a composite for multilayer circuit board as set forth in  claim 20 , wherein said intermediate composite (A) is obtained by applying a crosslinkable and polymerizable composition containing a bulk polymerizable monomer and said cross-linking agent (1) on said metal foil to form a coated film of said composition and applying heat to said coated film to be bulk polymerized. 
     
     
         23 . A manufacturing method of a composite for multilayer circuit board, comprising:
 forming an intermediate composite (B) by arranging a layer of metal foil, a crosslinkable resin layer containing a resin obtained by bulk polymerization reaction (3) and a cross-linking agent (α), and an adhesive resin layer containing an adhesive resin obtained by bulk polymerization reaction (4) in this order to be integrated to each other; and   heating said intermediate composite (B) to cross-link at least in part of said resin contained in said crosslinkable resin layer such that said crosslinkable resin layer becomes to be a hard resin layer containing a hard resin obtained by bulk polymerization reaction and cross-linking reaction.   
     
     
         24 . The manufacturing method of a composite for multilayer circuit board as set forth in  claim 23 , wherein said adhesive resin layer contains a cross-linking agent (β) having a one-minute half-life temperature higher than that of said cross-linking agent (α). 
     
     
         25 . The manufacturing method of a composite for multilayer circuit board as set forth in  claim 23 , wherein
 said intermediate composite (B) is obtained by:   applying a crosslinkable and polymerizable composition (a) containing a bulk polymerizable monomer and said cross-linking agent (α) on said metal foil;   applying a polymerizable composition (b) containing a bulk polymerizable monomer on said crosslinkable and polymerizable composition (a) applied on said metal foil; and   bulk polymerizing said crosslinkable and polymerizable composition (a) and the polymerizable composition (b) to form respectively the crosslinkable resin layer and the adhesive resin layer.   
     
     
         26 . The manufacturing method of a composite for multilayer circuit board as set forth in  claim 24 , wherein
 said intermediate composite (B) is obtained by:   applying a crosslinkable and polymerizable composition (a) containing a bulk polymerizable monomer and said cross-linking agent (α) on said metal foil;   applying a polymerizable composition (b) containing a bulk polymerizable monomer on said crosslinkable and polymerizable composition (a) applied on said metal foil; and   bulk polymerizing said crosslinkable and polymerizable composition (a) and the polymerizable composition (b) to form respectively the crosslinkable resin layer and the adhesive resin layer.   
     
     
         27 . The manufacturing method of a composite for multilayer circuit board as set forth in  claim 23 , wherein
 said intermediate composite (B) contains a fibrous material in said crosslinkable resin layer and/or said adhesive resin layer, and   said intermediate composite (B) is obtained by:   applying a erosslinkable and polymerizable composition (a) containing a bulk polymerizable monomer and said cross-linking agent (α) on one surface of said fibrous material;   applying a polymerizable composition (b) containing a bulk polymerizable monomer on the other surface of said fibrous material;   laminating said metal foil on said crosslinkable and polymerizable composition (a) applied on the one surface of said fibrous material; and   bulk polymerizing said crosslinkable and polymerizable composition (a) and said polymerizable composition (b) to form respectively said crosslinkable resin layer and said adhesive resin layer.   
     
     
         28 . The manufacturing method of a composite for multilayer circuit board as set forth in  claim 24 , wherein
 said intermediate composite (B) contains a fibrous material in said crosslinkable resin layer and/or said adhesive resin layer, and   said intermediate composite (B) is obtained by:   applying a crosslinkable and polymerizable composition (a) containing a bulk polymerizable monomer and said cross-linking agent (α) on one surface of said fibrous material;   applying a polymerizable composition (b) containing a bulk polymerizable monomer on the other surface of said fibrous material;   laminating said metal foil on said crosslinkable and polymerizable composition (a) applied on the one surface of said fibrous material; and   bulk polymerizing said crosslinkable and polymerizable composition (a) and said polymerizable composition (b) to form respectively said crosslinkable resin layer and said adhesive resin layer.   
     
     
         29 . The manufacturing method of a composite for multilayer circuit board as set forth in  claim 23 , wherein
 said intermediate composite (B) is obtained by:   applying a crosslinkable and polymerizable composition (a) containing a bulk polymerizable monomer and said cross-linking agent (α) on said metal foil and then forming said crosslinkable resin layer through a bulk polymerization reaction (3); and   applying a polymerizable composition (b) containing a bulk polymerizable monomer on said crosslinkable resin layer formed on said metal foil and then forming said adhesive resin layer through a bulk polymerization reaction (4).   
     
     
         30 . The manufacturing method of a composite for multilayer circuit board as set forth in  claim 24 , wherein
 said intermediate composite (B) is obtained by:   applying a crosslinkable and polymerizable composition (a) containing a bulk polymerizable monomer and said cross-linking agent (α) on said metal foil and then forming said crosslinkable resin layer through a bulk polymerization reaction (3); and   applying a polymerizable composition (b) containing a bulk polymerizable monomer on said crosslinkable resin layer formed on said metal foil and then forming said adhesive resin layer through a bulk polymerization reaction (4).   
     
     
         31 . A manufacturing method of a composite for multilayer circuit board, comprising:
 applying a crosslinkable and polymerizable composition (a) containing a bulk polymerizable monomer and a cross-linking agent (α) on a metal foil and then forming a crosslinkable resin layer through a bulk polymerization reaction (5);   cross-linking at least in part of said crosslinkable resin layer to form a hard resin layer containing a hard resin obtained by bulk polymerization reaction and cross-linking reaction; and   applying a polymerizable composition (b) containing a bulk polymerizable monomer on said hard resin layer and then forming an adhesive resin layer containing an adhesive resin obtained by bulk polymerization reaction through a bulk polymerization reaction (6).   
     
     
         32 . A single sided circuit board for multilayer circuit board, wherein
 a conductive circuit is formed by patterning said layer of the metal foil of the composite for multilayer circuit board as set forth in  claim 15 ,   a via hole is formed to penetrate through said hard resin layer and said adhesive resin layer and to make the conductive circuit exposed at a bottom surface side of the via hole, and   a conductor is given into said via hole.   
     
     
         33 . A single sided circuit board for multilayer circuit board, wherein
 a conductive circuit is formed by patterning said layer of the metal foil of the composite for multilayer circuit board as set forth in  claim 16 ,   a via hole is formed to penetrate through said hard resin layer and said adhesive resin layer and to make the conductive circuit exposed at a bottom surface side of the via hole, and   a conductor is given into said via hole.   
     
     
         34 . A method of manufacturing a multilayer circuit board comprising a plurality of circuit boards, wherein the method includes
 overlapping two or more of the single sided circuit board for multilayer circuit board as set forth in  claim 32  or overlapping said single sided circuit board for multilayer circuit board and other circuit board, followed by heat pressing to laminate.