X-Ray Opaque Coating

Abstract

The disclosure relates to an X-ray opaque coating containing an epoxy resin including an iodinated phenol covalently bonded to a glycidyl ether. Iodinated phenol covalently bonded to a glycidyl ether may include iodinated bisphenol A, such as tetraiodobisphenol A, a glycidyl ether of mono-iodophenol, bis-iodophenol, tri-iodophenol, or combinations thereof. The coating may include an X-ray opaque inorganic filler. The disclosure also relates to an electronic component including a substrate and at least one device coupled to the substrate with an obfuscation layer disposed over the substrate for obscuring the device from an X-ray source. The obfuscation layer may include an X-ray opaque coating. The disclosure additionally relates to a method of obscuring at least a portion of an electronic component by depositing an obfuscation layer that may include an X-ray opaque coating and a method of forming an X-ray opaque coating.

1 . An X-ray opaque coating comprising an epoxy resin formed from iodinated phenol covalently bonded to a glycidyl ether. 
     
     
         2 . The X-ray opaque coating according to  claim 1 , wherein the iodinated phenol covalently bonded to a glycidyl ether comprises iodinated bisphenol A. 
     
     
         3 . The X-ray opaque coating according to  claim 1 , wherein the iodinated phenol covalently bonded to a glycidyl ether comprises a diglycidyl ether of tetraiodobisphenol A. 
     
     
         4 . The X-ray opaque coating according to  claim 1 , wherein the iodinated phenol covalently boned to a glycidyl ether comprises a glycidyl ether of mono-, bis-, or tri-iodophenol, or a combination thereof. 
     
     
         5 . The X-ray opaque coating according to  claim 4 , wherein the combination comprises bis-iodophenol and at least one of mono- or tri-iodophenol, and wherein the combination comprises at least 50% bis-iodophenol. 
     
     
         6 . The X-ray opaque coating according to  claim 1 , wherein the iodinated phenol covalently bonded to a glycidyl ether comprises both a diglycidyl ether of tetraiodobisphenol A and a glycidyl ether of bis-iodophenol. 
     
     
         7 . The X-ray opaque coating according to  claim 1 , further comprising an X-ray opaque inorganic filler. 
     
     
         8 . The X-ray opaque coating according to  claim 5 , wherein the filler comprises at least one of the following; potassium iodide, bismuth iodide, barium chloride, barium iodide, barium sulfate, lead, lead iodide, lead acetate, lead oxide, or gold flake. 
     
     
         9 . The X-ray opaque coating according to  claim 5 , wherein the coating is highly filled and comprises up to 85% filler by weight. 
     
     
         10 . The X-ray opaque coating according to  claim 1 , wherein the epoxy resin comprises a cured resin. 
     
     
         11 . The X-ray opaque coating according to  claim 10 , wherein the epoxy resin comprises a triethylenetetraamine curing agent. 
     
     
         12 . An electronic component, comprising:
 a substrate;   at least one device coupled to the substrate; and   an obfuscation layer disposed over the substrate for obscuring the device from an X-ray source wherein the obfuscation layer comprises an X-ray opaque coating comprising an epoxy resin formed from iodinated phenol covalently bonded to a glycidyl ether.   
     
     
         13 . The electronic component according to  claim 12 , further comprising at least one connection, where in the obfuscation layer obscures the connection from an X-ray source. 
     
     
         14 . The electronic component according to  claim 12 , wherein the obfuscation layer varies in thickness across the substrate. 
     
     
         15 . The electronic component according to  claim 12 , wherein the iodinated phenol covalently bonded to a glycidyl ether comprises an iodinated bisphenol A. 
     
     
         16 . The electronic component according to  claim 12 , wherein the iodinated phenol covalently bonded to a glycidyl ether comprises a diglycidyl ether of tetraiodobisphenol A. 
     
     
         17 . The electronic component according to  claim 12 , wherein the iodinated phenol covalently bonded to a glycidyl ether comprises a glycidyl ether of mono-, bis-, or tri-iodophenol, or a combination thereof. 
     
     
         18 . The electronic component according to  claim 17 , wherein the combination comprises of bis-iodophenol and at least one of mono- or tri-iodophenol, and wherein the combination comprises at least 50% bis-iodophenol. 
     
     
         19 . The electronic component according to  claim 12 , wherein the iodinated phenol covalently bonded to a glycidyl ether comprises both a diglycidyl ether of tetraiodobisphenol A and a glycidyl ether of bis-iodophenol. 
     
     
         20 . The electronic component according to  claim 12 , further comprising an X-ray opaque inorganic filler. 
     
     
         21 . The electronic component according to  claim 20 , wherein the filler comprises at least one of the following; potassium iodide, bismuth iodide, barium chloride, barium iodide, barium sulfate, lead, lead iodide, lead acetate, lead oxide, or gold flake. 
     
     
         22 . The electronic component according to  claim 21 , wherein the coating is highly filled and comprises up to 85% filler by weight. 
     
     
         23 . The electronic component according to  claim 12 , wherein the epoxy resin comprises a cured resin. 
     
     
         24 . The electronic component according to  claim 23 , wherein the epoxy resin comprises a triethylenetetraamine curing agent. 
     
     
         25 . The electronic component according to  claim 12 , wherein the obfuscation layer comprises at least one sheet of X-ray opaque coating.