US2010263835A1PendingUtilityA1
Heat pipe
Est. expiryApr 17, 2029(~2.7 yrs left)· nominal 20-yr term from priority
Inventors:Cheng Wang
F28F 2240/00F28D 15/04F28D 15/0266F28D 15/046
43
PatentIndex Score
0
Cited by
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References
0
Claims
Abstract
A heat pipe includes a tube, a capillary structure, and a working fluid. The tube seals a space and has an evaporating portion, a condensing portion, and a heat insulation portion connected between the evaporating portion and the condensing portion. An opening area defined by one of the condensing portion and the evaporating portion is larger than an opening area defined by the heat insulation portion. The capillary structure is disposed on an inner surface of the tube. The working fluid is disposed in the tube.
Claims
exact text as granted — not AI-modified1 . A heat pipe, comprising
a tube, sealing a space and comprising an evaporating portion, a condensing portion, and a heat insulation portion connected between the evaporating portion and the condensing portion, wherein an opening area defined by one of the condensing portion and the evaporating portion is larger than an opening area defined by the heat insulation portion; a capillary structure, disposed on an inner surface of the tube; and a working fluid, disposed in the tube.
2 . The heat pipe as claimed in claim 1 , wherein the tube is made of a thermal conductivity material.
3 . The heat pipe as claimed in claim 2 , wherein the thermal conductivity material comprises metal.
4 . The heat pipe as claimed in claim 1 , wherein the tube is flat shape.
5 . The heat pipe as claimed in claim 4 further comprising a spacer, wherein the spacer is disposed in the tube for supporting two opposite sides of the tube.
6 . The heat pipe as claimed in claim 1 , wherein the capillary structure is selected from the group consisting of a sintered powder, a metal mesh capillary structure, and a groove type capillary structure.
7 . The heat pipe as claimed in claim 6 , wherein the sintered powder is disposed on the evaporating portion, the metal mesh capillary structure and the groove type capillary structure are disposed on the condensing portion.
8 . The heat pipe as claimed in claim 1 , wherein the opening area defined by the condensing portion is larger than the opening area defined by the heat insulation portion.
9 . The heat pipe as claimed in claim 8 , wherein the opening area defined by the evaporating portion is equal to the opening area defined by the heat insulation portion.
10 . The heat pipe as claimed in claim 9 , wherein the cross-sectional area of the capillary structure located in the area where the heat insulation portion is perpendicular to the extending direction of the heat pipe is larger than or equal to the cross-sectional area of the capillary structure located in the area where the condensing portion is perpendicular to the extending direction of the heat pipe.
11 . The heat pipe as claimed in claim 8 , wherein the opening area defined by the evaporating portion is larger than the opening area defined by the heat insulation portion.
12 . The heat pipe as claimed in claim 11 , wherein the cross-sectional area of the capillary structure located in the area where the heat insulation portion is perpendicular to the extending direction of the heat pipe is larger than or equal to the cross-sectional area of the capillary structure located in the area where the condensing portion and the evaporating portion are perpendicular to the extending direction of the heat pipe.
13 . The heat pipe as claimed in claim 1 , wherein the heat pipe is line shape, the evaporating portion and the condensing portion are located at two sides of the heat insulation portion respectively.
14 . The heat pipe as claimed in claim 1 , wherein the heat pipe is U shape, the evaporating portion is located at the middle of the heat pipe, the condensing portion is located at two sides of the heat pipe, the heat insulation portion is located at two curved sections of the heat pipe and connects to the evaporating portion and the condensing portion.Join the waitlist — get patent alerts
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